Package and method for packaging an integrated circuit wafer

Abstract

An integrated circuit assembly includes a lead frame having a plurality of leads with inner portions. A thermally-conductive clip member is bonded to the inner portions of the leads such that the clip member is electrically isolated from yet thermally coupled to the lead frame. An integrated circuit die is bonded and thereby thermally coupled to the clip member. The die is electrically connected to the wire die by wire bonds. Encapsulant material is disposed over the inner portions of the leads and at least a portion of the clip member, and encapsulates the die and the wire bonds.

Description

[0001] Cross References to Related Inventions [0002] This application claims the benefit of US Patent Application Serial No. 10 / 864,909, filed June 9,2004. technical field [0003] The present invention relates generally to semiconductor devices, and more particularly to a package and method for packaging an integrated circuit die. Background technique [0004] The integrated circuit die is sealed within the package to protect the circuit die and the electrical interconnections formed thereon from the external environment. A method of packaging an integrated circuit die generally involves the process of bonding the die to die pads or pads of a leadframe. One configuration of such packages is commonly referred to as a micro-leaded package. After the die is bonded to the leadframe, the bond pads on the die are wire bonded to the inner leads or lead fingers of the leadframe, and the die, inner leads and bond wires are encapsulated in an encapsulant. [0005] Bonding the d...

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Problems solved by technology

Therefore, the entire surface area of ​​the lead frame is not used to help dissipate heat

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