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Highly adhesive polyimide film and method for producing same

A polyimide film, p-phenylenediamine technology, applied in the direction of printed circuit manufacturing, coating, printed circuit, etc., to achieve the effect of improving low adhesion, high adhesion and improving adhesion

Active Publication Date: 2007-08-15
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the purpose of the polyimide film used in this document is to balance the various properties of the film suitable for TAB tapes, and it does not mention at all that it is possible to improve the lamination with the metal foil through the adhesive by specifying the birefringence index. time tightness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0084] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples.

[0085] In addition, the average birefringence, elastic modulus, linear expansion coefficient, and adhesiveness evaluation method in the synthesis example, the Example, and a comparative example are as follows.

[0086] (average birefringence)

[0087] Put the film cut into 2 × 2 cm under the crossed Nicols prism and use a polarizing microscope (OPTIPHOT·POL manufactured by Japan Optical Corporation) to determine the extinction angle, as the average value of the birefringence in the two orthogonal directions (i.e. The average value of the maximum value and the minimum value of the birefringence index) is obtained. In addition, the so-called birefringence referred to in the present invention is the difference between the refractive index in the film in-plane direction and the refractive index in the thickness direction.

[0...

reference example 1

[0098] (Reference Example 1: Synthesis of thermoplastic polyimide precursor)

[0099] Add 780 g of DMF and 115.6 g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) to a glass flask with a capacity of 2000 ml, slowly add 3 while stirring under a nitrogen atmosphere, 78.7 g of 3',4,4'-biphenyltetracarboxylic dianhydride (BPDA). Next, 3.8 g of ethylene bis(trimellitic acid monoester anhydride) (TMEG) was added, and it stirred under ice bath for 30 minutes. Separately, a solution in which 2.0 g of TMEG was dissolved in 20 g of DMF was prepared, and this solution was gradually added to the above-mentioned reaction solution and stirred while paying attention to the viscosity. When the viscosity reached 3000 poise, the addition and stirring were stopped to obtain a polyamic acid solution.

[0100] This polyamic acid solution was cast onto a 25 μm PET film (Cerapel HP, manufactured by Toyo Metal Raising Co., Ltd.) to a final thickness of 20 μm, and dried at 120° C. for 5 minutes. ...

Embodiment 1

[0106] In Comparative Example 1, except using a curing agent composed of acetic anhydride / isoquinoline / DMF (weight ratio 14 / 5 / 30), the drying conditions on the aluminum foil were dried at 150° C. for 70 seconds. 1 A polyimide film having a thickness of 18 μm was produced in the same manner. In addition, the volatile content of the gel film was 46% by weight. Table 1 shows the obtained film properties and adhesive properties.

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PUM

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Abstract

Disclosed is a polyimide film having good adhesion to an adhesive, especially to a polyimide adhesive. Specifically disclosed is a non-thermoplastic polyimide film whose raw material is composed of a diamine essentially containing 2,2-bisaminophenoxyphenylpropane and paraphenylene diamine, and an acid dianhydride component essentially containing a pyromellitic acid dianhydride and 3,3',4,4'-benzophenone tetracarboxylic acid dianhydride. This non-thermoplastic polyimide film is characterized by having an average birefringence of less than 0.14.

Description

technical field [0001] The present invention relates to a non-thermoplastic polyimide film that exhibits high adhesion to an adhesive, especially a thermoplastic polyimide, and can be suitably used in a two-layer CCL. Background technique [0002] In recent years, with the light weight, miniaturization and high density of electronic products, the demand for various printed substrates is increasing, among which the demand for flexible laminates (also called flexible printed circuit boards (FPC), etc.) is growing particularly fast. The flexible laminate has a structure in which a circuit composed of a metal foil is formed on an insulating film. [0003] The above-mentioned flexible laminate is generally formed of various insulating materials, using a flexible insulating film as a substrate, and using a method of bonding metal foil to the surface of the substrate by heating and pressing through various adhesive materials. etc. to manufacture. As the insulating film, a polyimi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08J5/18C08G73/1042C08J2379/08C09D179/08H05K1/0346H05K1/0393H05K3/386C08L2203/16
Inventor 金城永泰菊池刚
Owner KANEKA CORP
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