Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pump and pumping system

一种泵壳、电子基板的技术，应用在泵和泵系统领域，能够解决不能满足信息设备小型化要求电子元器件高密度安装要求、增大电子基板面积、异常工作和故障等问题，达到实现小型化、提高安装效率、防止异常工作和故障的效果

Inactive Publication Date: 2011-06-08
SANKYO SEIKI MFG CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, if the pump and the processing circuit including the driver IC are located at a distance from each other, only this will increase the area of ​​the electronic substrate, so it cannot meet the miniaturization requirements of information equipment and the high-density mounting requirements of various electronic components.
[0008] Also, in the way the flexible ribbon and lead wires have been routed from the pump in the past, the electrical signals flowing through them sometimes generated noise on the electronic substrate
At this time, various electronic components may experience abnormal operation and failure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pump and pumping system
  • Pump and pumping system
  • Pump and pumping system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] Next, the best mode for carrying out the present invention will be described with reference to the drawings.

[0049] [Mechanical structure]

[0050] figure 1 It is a mechanical configuration diagram showing the pump 1 according to the embodiment of the present invention. in particular, figure 1 (a) shows a side sectional view of the pump 1, figure 1(b) is a schematic plan view showing the positional relationship between the stator 12 and the driver IC 16 . In addition, for the convenience of explanation, figure 1 (a) is upside down.

[0051] exist figure 1 In (a), the pump 1 according to this embodiment is mainly composed of an impeller 11 , a stator 12 , a pump casing 13 , and a bottom plate 14 .

[0052] A plurality of blades 111 are formed on the outer periphery of the impeller 11 , and the rotation of the impeller 11 induces eddy currents around the blades 111 . In addition, by performing waterproof processing on the surface of the blade 111, it is possible...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a pump and a pump system capable of improving mounting efficiency to satisfy miniaturization demand of information apparatus and high density mounting demand of various types of electronic components and of being controlled without pulling out flexible tape or the like from the pump. The pump 1 includes an impeller 11 having a plurality of blades 111 formed on an outer circumference and a rotor magnet 112 provided on an inner circumference, a plurality of projecting pole parts arrange with opposing to the rotor magnet 112 and radially extending toward a radial directionoutward of the impeller 11, a pump casing 13 put between the rotor magnet 112 and a plurality of the projecting pole parts 121, a drive IC 16 supplying current to a coil wound around the plurality ofprojecting pole parts 121, and electronic substrate 15 having the drive IC 16 mounted thereon. The electronic substrate 15 is fixed on the pump casing 13 under a condition where the drive IC 16 is put between the plurality of projecting pole parts 121.

Description

technical field [0001] The invention relates to a pump and a pump system, which are used for the circulation of refrigerant for cooling electronic components and the fuel circulation of a fuel cell, and in particular to a pump and a pump system for improving the installation efficiency. Background technique [0002] In recent years, with the high performance and high functionality of information equipment, the heat generated by the electronic components inside the information equipment has gradually increased, so cooling devices have become more and more important. For example, since the clock frequency of the CPU has greatly improved compared to the past, a method in which a refrigerant is circulated inside to cool the LSI and the like is actually adopted. On the other hand, in recent years, the development of fuel cells is rapidly advancing. This fuel cell is a battery that circulates fuel and extracts electrical energy, and it tends to be more and more miniaturized, and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F04D5/00F04D23/00F04D29/42
CPCF04D13/0673F04D5/002H02K11/0073F04D29/588H02K7/14H02K11/33F04D13/0686
Inventor 栗田幸信
Owner SANKYO SEIKI MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com