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White light-emitting diode package structure

A technology of light-emitting diodes and packaging structures, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as color temperature difference and uneven distribution of phosphor powder, achieve uniform color temperature, and improve the effect of external light extraction efficiency

Inactive Publication Date: 2007-08-29
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

[0007] The purpose of the present invention is to overcome the defects existing in the existing white light emitting diodes, and provide a new packaging structure of white light emitting diodes. The problem of color temperature difference caused by it is more suitable for practical use

Method used

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  • White light-emitting diode package structure

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Embodiment Construction

[0038] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of the white light emitting diode packaging structure proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Efficacy, detailed as follows.

[0039] The invention provides a white light-emitting diode suitable for normal and high-power operation, which can produce high-brightness and high-uniformity white light. It utilizes a fluorescent powder colloid coating layer that forms an arc-shaped lens body and lays a high-level LED on its arc side. Concentrated phosphor powder to produce white light with high brightness and high uniformity.

[0040] First of all, in order to meet the requirement of high brightness, the external light extraction efficiency of LED must be improved. Since the ...

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Abstract

This invention relates to a package structure of a white light LED including a base, light emitting semiconductor elements and a cladding of a fluorescent colloid, in which, the light emitting semiconductor elements are set on the base, the cladding is adhered on the base and covers the semiconductor elements and is an arc lens formed naturally, the arc side of which includes a fluorescent powder layer distributed in the powder layer. This invented cladding of a fluorescent colloid forms an arc lens with natural surface tension and cohesion to increase the outside extraction efficiency of white light LED, besides, fluorescent powder is deposited on the arc side of the cladding of the fluorescent powder colloid uniformly to form a uniform distributed fluorescent powder layer to let white light LED generate uniform color temperature.

Description

technical field [0001] The present invention relates to a white light emitting diode, in particular to a packaging structure of a white light emitting diode, which has a fluorescent powder colloid coating layer shaped like an arc-shaped lens body, and the arc side of the fluorescent powder colloid coating layer It has a phosphor layer. Background technique [0002] In today's light-emitting diode (LED) industry, white light, warm light and pink light are widely used in the packaging technology of light-emitting diodes to obtain different light-emitting spectrum combinations. For example, the general white light-emitting diode light-emitting mode is to use a blue chip plus a yellow phosphor, and the blue light emitted by the blue chip excites the yellow phosphor to generate yellow light, which is then mixed with the remaining blue light And produce white light. [0003] Please refer to FIG. 1 , which is a cross-sectional view of a conventional packaging structure of a white...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50
Inventor 吴易座
Owner EVERLIGHT ELECTRONICS
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