2results about How to "Improve horizontal scalability" patented technology

The invention discloses an Internet of Things code distributed analysis method and system and a storage medium. The analysis method comprises Internet of Things code release and Internet of Things code analysis which are performed in sequence. The Internet of Things code publishing comprises the following steps: when an Internet of Things device end changes, publishing an Internet of Things code of the Internet of Things device end and corresponding analysis data to a distributed hash table network (DHT); and when the client needs to parse the Internet of Things code, executing an Internet of Things code parsing process. According to the method, a Kademlia routing algorithm of the DHT is utilized, a'provider mechanism 'is creatively adopted, only a lightweight'data provider index' is stored and distributed in the DHT, and when an Internet of Things code is queried, the DHT quickly returns a list of nodes holding code information. And the query party directly obtains the latest equipment information from the provider. The method is an extremely light-weight operation, almost takes effect in real time, and solves the problem of cache delay of a traditional DNS (Domain Name Server).

The embodiment of the present disclosure provides a light-emitting diode with improved current spreading capability and a preparation method thereof, and belongs to the technical field of semiconductors. The light-emitting diode comprises a light-emitting structure, a first passivation layer, a connecting electrode layer, a second passivation layer and a pad electrode layer. The connecting electrode layer comprises a plurality of first connecting electrodes and a plurality of second connecting electrodes arranged alternately and spaced apart in a strip shape in a first direction. The length direction of the first connecting electrodes and the second connecting electrodes is a second direction, and the first direction and the second direction intersect. Each first connecting electrode is electrically connected to a first semiconductor layer in a plurality of grooves through a plurality of first through holes penetrating the first passivation layer. Each second connecting electrode is electrically connected to a second semiconductor layer through a plurality of second through holes penetrating the first passivation layer. The embodiment of the present disclosure can improve the light-emitting efficiency and reliability of the LED and reduce the driving voltage of the LED.