Socket for semiconductor apparatus

Abstract

The invention provides a socket for electrical connecting a chip with a circuit board. The chip contains at least a conductive port, and the circuit board contains at least a contact point corresponding to the conductive port. The socket contains a substrate and at least a conductive pillar. The substrate contains a hole penetrating the substrate. The conductive pillar is configured to pass through the hole. When the socket is disposed between the chip and the circuit board, a first end of the pillar contacts with the conductive port, and a second end of the same contacts to the contact point.

Description

technical field [0001] The present invention relates to a socket, and in particular to a socket for connecting an IC chip and a printed circuit board. Background technique [0002] In existing electronic products, many central processing unit (CPU) chips and digital micro-mirror devices (digital micro-mirror devices, DMDs) in projectors are packaged in a ball grid array (BGA) . When a user fixes an IC chip packaged in a BGA manner to a circuit board, usually a socket is placed between the chip and the circuit board instead of directly soldering the chip to the circuit board. When a problem occurs to the chip, the user does not need to unsolder the chip from the circuit board, but directly replaces the chip on the socket. [0003] See Figure 1. FIG. 1(A) is a schematic diagram of a socket 10 according to the prior art. FIG. 1(B) is a cross-sectional view of the socket 10 along the direction of the arrow 18 . The socket 10 includes a base plate 14 , and the base plate 14 ...

AI Technical Summary

Problems solved by technology

Since the contact area between the current C-shaped spring and the chip or circuit board is too small, it is difficult to avoid poor contact, and even affect the signal transmission between th

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