Composite coating of printed circuit board drill point and preparation method thereof

Abstract

The invention provides a composite coating of a printed circuit board drill point and a preparation method thereof. The composite coating sequentially comprises a bottom layer, a carbonitriding layer,a diamond-like carbon coating and a heat insulation layer from the surface of the drill point to the outside; the bottom layer comprises any one of a metal layer, an alloy layer or a metal compound layer; and the heat insulation layer is a metal nitride ceramic layer. According to the composite coating, through the design of a multi-coating structure, the hardness and abrasion resistance of the drill point can be effectively improved through the arrangement of the diamond-like carbon coating, so that the service life of the drill point is prolonged; the adhesion strength of the diamond-like carbon coating can be effectively improved through the arrangement of the carbonitriding layer, and the problem that the diamond-like carbon coating is prone to falling off is avoided; the heat insulation layer can delay graphitization of the diamond-like carbon coating, so that the service life of the drill point is further prolonged; and through deposition of a composite coating, the drill pointis particularly suitable for drilling of a high-frequency and high-speed printed circuit board, and obtained drilled holes are high in quality and precision.

Description

technical field

[0001] The invention belongs to the technical field of printed circuit board processing, and relates to a composite coating for a printed circuit board drill and a preparation method thereof. Background technique

[0002] With the rapid development of the electronic communication industry, especially the commercialization of 5G technology, the requirements for printed circuit board (PCB) materials are getting higher and higher. Compared with the traditional epoxy glass fiber cloth substrate, the new high-frequency high-speed board material The proportion of ceramic materials in the composition has been greatly increased. Because the ceramic material is hard and brittle and easy to break, when drilling a printed circuit board with a drill, the drill is severely worn, easy to break, and generally has a short service life, which is difficult to meet the needs of the 5G communication field. The requirements of high drilling efficiency, low wear, uniform and stabl...

Images