Heat interfacial material

Abstract

The invention discloses a heat boundary material, which consists of substrate material and several carbon nanometer pipes dispersed in the substrate material, wherein the even length of carbon nanometer pipe is 600-2000nm with at least one end opened.

Description

technical field [0001] The invention relates to a thermal interface material, in particular to a thermal interface material containing carbon nanotubes. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, while the volume of devices has become smaller and smaller, and its heat dissipation has become an increasingly important issue. The requirements are also getting higher and higher. In order to meet these needs, various heat dissipation methods have been widely used, such as fan heat dissipation, water cooling auxiliary heat dissipation and heat pipe heat dissipation, etc., and a certain heat dissipation effect has been achieved. However, due to the uneven contact interface between the heat sink and the semiconductor integrated device, Generally, less than 2% of the area is in contact with each other, and there is no id...

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Problems solved by technology

However, the thermal conductivity of thermal interface materials containing carbon nanotubes provided in the prior art still has a certain gap with the expected effect.

The reason is that the carbon nanotubes in the above-mentioned thermal interface materials are mostly distributed laterally, and the length of the carbon nanotubes is relatively large, so they are prone to intertwining or self-twisting, so the high longitudinal thermal conductivity of carbon nanotubes cannot be fully utilized. specialty

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