Substrate supporting/transferring tray

A substrate and tray technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of uneven temperature and difficult uniform heating of the substrate 1, and achieve the effect of uniform heating

Inactive Publication Date: 2007-10-24
CANON ANELVA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the temperature is not uniform between the central portion side of the substrate supporting and transporting tray 18a and the outer peripheral edge side 18c of the substrate supporting and transporting tray 18a, and as a result, it is difficult to uniformly heat the substrate 1.

Method used

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  • Substrate supporting/transferring tray
  • Substrate supporting/transferring tray
  • Substrate supporting/transferring tray

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0020] Next, preferred embodiments of the present invention will be described with reference to the drawings.

[0021] FIG. 1 is a diagram illustrating a first embodiment of the present invention.

[0022] A substrate support member 2 is provided inside a processing chamber 11 for heat-processing a substrate 1 . The substrate supporting member 2 has a heating member 4 for heating the substrate, which is composed of a thermoelectron generating member for electron impact heating, an infrared lamp for infrared lamp heating, and the like inside. Accordingly, the substrate 1 is heat-processed in the processing chamber 11 .

[0023] The heat treatment of the substrate 1 in the processing chamber 11 may be performed with the inside of the processing chamber 11 in a predetermined vacuum state, or may be performed with the inside of the processing chamber 11 in an atmospheric pressure state.

[0024] The substrate supporting and transporting tray 8 of the present invention is placed ...

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PUM

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Abstract

To provide a substrate supporting / transferring tray, which can be placed on a substrate supporting part arranged in a treatment chamber wherein heat treatment is performed to a substrate, especially on a substrate supporting part having a built-in heating means for heating the substrate, and on an upper side of which, the substrate is placed. At the time of heat-treating the substrate, the substrate can be more uniformly heated, and when the heat treatment is completed, the tray can be easily removed from the substrate supporting part without waiting for the temperature of the substrate to be reduced, and can transfer the substrate to other parts from the treatment chamber wherein the heat treatment is performed. The substrate supporting / transferring tray, which has the disc-shaped substrate supporting part on an upper plane side, and is provided with a cylindrical side wall part extending from a periphery of the disc-shaped substrate supporting part to a lower side, and an annular part extending from a lower end side of the cylindrical side wall part to an outer side in a diameter direction.

Description

technical field [0001] The present invention relates to a tray for supporting and transporting a substrate, which is placed on a substrate supporting member provided in a processing chamber for heat-processing a semiconductor substrate, and on which a substrate is placed. In particular, it relates to a tray for supporting and transporting a substrate, which is placed on a substrate supporting member having a heating member for heating the substrate therein, and in which a semiconductor substrate is placed on the upper side. Background technique [0002] In a semiconductor manufacturing apparatus, heat treatment of a semiconductor substrate is performed in a processing chamber in a vacuum state or an atmospheric pressure state. In this case, uniform heating of the semiconductor substrate, transfer of the semiconductor substrate after heat treatment, etc. are considered. The semiconductor substrate is heat-treated in a state where the semiconductor substrate is placed on the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/673
CPCH01L21/67103H01L21/6831H01L21/68714H01L21/68735H01L21/67346H01L21/683
Inventor 柴垣真果榑松保美
Owner CANON ANELVA CORP
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