Sputtering device and method

A technology of sputtering and sputtering chamber, applied in the field of sputtering, which can solve the problems of low production efficiency, inability to form thickness, and inability to achieve plating, etc., to achieve the effect of improving production efficiency and simple and convenient operation

Inactive Publication Date: 2007-12-05
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
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Problems solved by technology

[0004] However, most of the existing sputtering devices are designed for regular planar substrates and can only form coatings on the surface of the substrate opposite to the target. Therefore, it is necessary to replace the substrate several times when coating irregular shaped workpieces such as lens mounts. location, so that the production efficiency is low, and sometimes it is impossible to achieve complete plating, and it is also impossible to form a uniform thickness of the coating

Method used

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  • Sputtering device and method
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Embodiment Construction

[0014] A sputtering device for sputtering workpieces with irregular shapes and a sputtering method using the sputtering device will be described below by taking sputtering on the surfaces of multiple workpieces as an example.

[0015] Please refer to FIG. 1 , which is a sputtering device 200 provided in this embodiment, which includes a sputtering chamber 21 , which forms a cavity inside. In this embodiment, the sputtering chamber 21 is a cylindrical chamber. The sputtering chamber 21 is provided with a first sputtering target 22 , a second sputtering target 24 , a base turntable 26 and multiple pairs of carrying platforms 28 .

[0016] The first sputtering target 22 is fixed on the top of the sputtering chamber 21 and is opposite to the upper surface of the base turntable 26 inside the sputtering chamber 21 . The first sputtering target 22 is directly connected to the cathode of the sputtering power supply or grounded through a wire 401 .

[0017] The second sputtering targ...

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Abstract

The present invention relates to one kind of sputtering apparatus, which includes one sputtering cavity, one first sputtering target, one second sputtering target, one bottom turntable and several pairs of bearing stages. The first sputtering target is set oppositely to the upper surface of the bottom turntable, the second sputtering target is set around the bottom turntable, the bottom turntable is connected to one rotating unit for rotating, and the bearing stage pairs on the upper surface are connected to connecting rods and a drive unit for rotating. The present invention also relates to the sputtering process with the sputtering apparatus. The present invention can sputter several irregular workpieces in high production efficiency.

Description

technical field [0001] The present invention relates to a sputtering device and a sputtering method, in particular to a sputtering device suitable for sputtering workpieces with irregular shapes and a sputtering method using the sputtering device. Background technique [0002] Sputtering is a thin film physical vapor deposition technology. With the development of electronic technology and vacuum technology, it has been widely used in the production of various metal and non-metal film layers in industry. The principle of sputtering is to use high-energy plasma generated by glow discharge or ion beam to hit the target in a vacuum environment, and atoms are knocked out of the target by momentum transfer and deposited on the substrate to form a thin film. [0003] In mobile phone camera modules, in order to shield electromagnetic interference, a layer of metal, such as stainless steel or metal copper, is often plated on the lens mount by sputtering technology to prevent noise fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/54
Inventor 颜士杰
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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