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Carbon nanotube-based filler for integrated circuits

A technology of integrated circuits and carbon nanotubes, which is applied in the field of carbon nanotube-based fillers for integrated circuits, and can solve performance problems and other problems

Active Publication Date: 2007-12-26
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, as high performance ICs are required, heat-related performance fluctuations can cause performance issues

Method used

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  • Carbon nanotube-based filler for integrated circuits
  • Carbon nanotube-based filler for integrated circuits

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Embodiment Construction

[0021] While the present invention is applicable to various modifications and alternative forms, features thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the invention is not limited to the particular embodiments described herein. On the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined in the appended claims.

[0022] It is believed that the present invention is applicable to various circuits and methods that include and / or benefit from encapsulation materials, particularly those that use chip-package configurations such as molding or potting. While the invention is not necessarily limited to these applications, a full understanding of the invention can be obtained through a discussion of examples in this context.

[0023] According to an example embodiment of the present invention, carbon nanotube type fill...

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Abstract

A variety of characteristics of an integrated circuit chip arrangement with a chip and package-type substrate are facilitated. In various example embodiments, a carbon nanotube-filled material (110) is used in an arrangement between an integrated circuit chip (220, 340) and a package-type substrate (210, 350). The carbon-nanotube filled material is used in a variety of applications, such as package encapsulation (as a mold compound (330)), die attachment (374) and flip-chip underfill (240). The carbon nanotubes facilitate a variety of characteristics such as strength, thermal conductivity, electrical conductivity, durability and flow.

Description

technical field [0001] The present invention relates to integrated circuit devices and methods thereof, and more particularly to integrated circuit molding or attachment fillers employing nanotube materials. Background technique [0002] Fillers such as mold compounds and underfills for integrated circuit chip applications play an important role in the fabrication and implementation of circuits. For example, integrated circuits, flip-chip type circuits, and other components are typically mounted on a substrate using a molding material that encapsulates the circuitry on the substrate. For some applications, the filler is used as an underfill under a circuit such as a chip, in or around a circuit connection such as a solder ball connector. [0003] In either overmolding or underfill applications, the filler serves to hold the circuit and / or chip in place. Additionally, fillers can be used to electrically insulate certain circuits and connectors. [0004] Various fillers hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/29
CPCH01L2924/01074H01L2924/14H01L2924/15311H01L2224/29393H01L2224/2929H01L2924/01005H01L2924/01082H01L2224/2919H01L21/563H01L2224/29101H01L2924/014B82Y10/00H01L2224/29H01L2924/00013H01L2924/01047H01L24/29H01L23/373H01L24/32H01L2924/01006H01L2924/01033H01L2224/73203H01L2924/0665H01L2224/29298H01L23/295H01L2924/351H01L2924/181H01L2924/00H01L2924/00014H01L2924/3512H01L2224/29099H01L2224/29199H01L2224/29299H01L23/34B82Y30/00
Inventor 克里斯·怀兰德亨德里克斯·约翰尼斯·乔卡巴斯·托仑
Owner TAIWAN SEMICON MFG CO LTD