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Semiconductor component and method for manufacturing semiconductor component

A semiconductor and component technology, which is applied in the field of semiconductor components and the manufacture of semiconductor components

Active Publication Date: 2008-01-02
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, known isolation using trenches as shown in FIG. 1B does not provide the possibility of contact with the substrate as is the case with diffusion isolation described with reference to FIG. 1A

Method used

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  • Semiconductor component and method for manufacturing semiconductor component
  • Semiconductor component and method for manufacturing semiconductor component
  • Semiconductor component and method for manufacturing semiconductor component

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Embodiment Construction

[0048] In the following detailed description, reference is made to the accompanying drawings, which constitute a part of this specification, and in which are shown by way of illustrations specific embodiments in which the invention may be practiced. In this regard, directional terms such as "top", "bottom", "front", "rear", "leading", "trailing", etc., are used with reference to the orientation of the depicted figures. Since components of embodiments of the present invention may be positioned in many different orientations, directional terms are used for purposes of illustration only and are in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. Accordingly, the following detailed description is not to be taken in a limiting sense, and the scope of the invention will be defined by the appended claims.

[0049] In the figures, identical or mutuall...

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Abstract

The present invention relates to a semiconductor component and a method for manufacturing the same. The semiconductor component comprises a semiconductor body, which includes a substrate of a first conducting type, a buried semiconductor layer of a second conducting type being arranged on the substrate, a functional cell semiconductor layer of a third conducting type being arranged on the buried semiconductor layer. The functional cell semiconductor layer provides at least two semiconductor functional cells being arranged landscape orientation in a row. The buried semiconductor layer is part of at least one semiconductor functional cell. The semiconductor functional cells are electrically insulated with each other by means of the functional semiconductor layer, the buried semiconductor layer and the separating structure of the substrate. The separating structure comprises at least a trench and a conducting contact with the substrate, the contact is electrically insulated with the functional cell semiconductor layer and the buried layer by means of at least one trench.

Description

technical field [0001] One aspect of the invention relates to a semiconductor component having a semiconductor body comprising a substrate of a first conductivity type, a buried semiconductor layer of a second conductivity type arranged on the substrate, a buried semiconductor layer arranged on the buried semiconductor layer A functional unit semiconductor layer of a third conductivity type on the upper surface, and a contact from the surface of the semiconductor body to the substrate, in which at least two semiconductor functional units arranged laterally side by side are arranged. The buried semiconductor layer is part of at least one semiconductor functional unit. The semiconductor functional units are electrically insulated from each other by an isolation structure, and the isolation structure passes through the functional unit semiconductor layer, the buried semiconductor layer and the substrate. Background technique [0002] The lateral space requirements of semicondu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/04H01L23/52H01L21/822H01L21/76H01L21/768
CPCH01L21/76283H01L21/743H01L21/76286
Inventor A·梅瑟W·哈特纳H·格鲁伯D·博纳特T·格罗斯
Owner INFINEON TECH AG
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