Defect detecting device and defect detecting method

Abstract

The invention relates to a defect inspection device and defect inspection method, which can reduce the consignment stage of manufacturing process. A control devision (14) generates defect information of identifying the defect of substrate at the time of detecting substrate. After inspecting, the control devision (14) compares the defect information of said substrate generated at the time of inspecting with defect information generated at the time of an inspection of a lower layer of said substrate. The repeated defect repeated with the defect of the lower layer is removed to generate noted-flaws information which identifies a defect generated on said top layer layer. A decision means (13) which judges a taking-out place of said substrate based on said noted-flaws information of the top layer output from the data operation part, and informs control devision (14).

Description

technical field [0001] The present invention relates to a defect inspection device and a defect inspection method for detecting defects by inspecting the appearance of an object to be inspected. This application claims priority based on Japanese Patent Application No. 2006-183112 for which it applied in Japan on July 3, 2006, and uses the content here. Background technique [0002] In the process of manufacturing (photolithography) mother glass substrates (workpieces) for liquid crystal displays, after forming a thin film on the workpiece, etc., inspections are performed for defects such as scratches, dirt adhesion, and circuit pattern defects on the surface of the workpiece. In this defect inspection, after a workpiece is loaded into the defect inspection device, the defect inspection device detects a defect on the workpiece through image processing or the like, and generates defect information including information such as a defect position for identifying the defect. Thi...

AI Technical Summary

Problems solved by technology

[0008] In this way, conventionally, as a result of determining the transport destination (destination) of a workpiece based on defect information including lower-layer defects, the workpiece may not be transported to an appropriate transport destination.

In this case, the time for moving the workpiece in and out of the transport box and the transport time are useless, and the defect inspection is repeated during the retrospective inspection, so there is a problem that the lead time for starting the manufacturing process cannot be shortened.

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