Method for manufacturing copper nano granule and copper nano granule produced thereby

A metal nanoparticle, free technology, applied in the direction of nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve the problems of not solving various problems, not providing the manufacture of small and uniform particles, etc.

Inactive Publication Date: 2008-01-16
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, they neither provide a method for making small and uniform particles of less than 100 nm, nor do they solve various problems in economically mass-producing particles

Method used

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  • Method for manufacturing copper nano granule and copper nano granule produced thereby
  • Method for manufacturing copper nano granule and copper nano granule produced thereby
  • Method for manufacturing copper nano granule and copper nano granule produced thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Example 1: Manufacture of Copper Nanoparticles

[0052] 0.2 mol of sodium hypophosphate and 1 mol of PVP were mixed and dissolved in 400 ml of ethylene glycol in a beaker with a stirrer to prepare a first solution, and heated to 90°C. 0.1 mol of copper sulfate was dissolved in 100 ml of ethylene glycol to prepare a second solution and heated to 90°C. The second solution was injected into the first solution all at once at 90° C., and the resulting solution was vigorously stirred with a stirrer. After the solution was turned into dark brown by the reduction reaction, cooled distilled water was added, the solution was rapidly cooled and centrifuged to obtain dark brown copper nanoparticle powder. Then, the obtained particles were washed 3 times with acetone and distilled water, and dried in a vacuum dryer at 50° C. for 3 hours to finally recover 12 g of copper nanoparticles.

Embodiment 2

[0053] Example 2: Manufacture of Copper Nanoparticles

[0054] 1.6 moles of sodium hypophosphate and 4 moles of PVP were mixed and dissolved in 900 ml of ethylene glycol in a beaker with a stirrer to prepare a first solution, and heated to 90°C. A second solution was prepared by dissolving 0.4 mol of copper sulfate in 100 ml of ethylene glycol and heated to 90°C. The second solution was injected into the first solution all at once at 90° C., and the resulting solution was vigorously stirred with a stirrer. After the solution was turned into a dark brown color by a reduction reaction, cooled distilled water was added, and the solution was rapidly cooled and centrifuged to obtain a dark brown copper nanoparticle powder. Then, the obtained particles were washed 3 times with acetone and distilled water, and dried in a vacuum dryer at 50° C. for 3 hours to finally recover 26 g of copper nanoparticles.

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Abstract

The present invention relates to a method for manufacturing cuprum nanometer particle, especially relates to a method for manufacturing cuprum nanometer particle including the following steps: preparing a first solution, which contains polarity impregnant, dispersant and one or more reducers of group composed of diphosphate sodium (NaH2PO2), hydrazine (N2H4), hydrochloride and sodium borohydride (NaBH4), and heating the solution; preparing a second solution containing polarity impregnant and cuprum precursor, and heating the solution; adding the heated second solution into the heated first solution disposably, and mixing them. According to the present invention, the thin and even cuprum nanometer particle can be made simply, thus, the method is used for mass manufacturing the cuprum nanometer particle.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 2006-0064501 filed on Jul. 10, 2006, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a method for producing copper nanoparticles with uniform particle size and good dispersibility from copper ions in aqueous solution. Background technique [0004] Recently, with the trend toward miniaturization and higher density of electronic components, there has been an increasing demand for metal patterning of thin films or formation of micro-wiring on substrates by inkjet. [0005] In order to implement it, it is required that the conductive ink should be prepared from nano-sized copper particles exhibiting good dispersibility, uniform shape and narrow particle distribution. [0006] There are various conventional methods for producing metal nanoparticles, for example, mechanical milling...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/054
CPCC22C9/00C22B15/0089B22F9/24H01B1/026B22F1/0018B82Y30/00Y02P10/20B22F1/054B82B3/00B82Y40/00
Inventor 李永日吴龙洙郑在祐
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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