Display panel and encapsulation structure of its control circuit

Abstract

A display panel comprises an array baseplate, a control circuit connection region, a conducting wire pattern, an insulation layer covered on the conducting wire pattern, a transparent conducting layer equipped on the insulation layer, a conductive adhesive equipped on the transparent conducting layer and the insulation layer. The insulation layer has a plurality of outer lead bonding apertures and a plurality of conducting wire pattern apertures which expose the part of the conducting wire pattern. The transparent conducting layer is electrically connected with the conducting wire pattern via the outer lead bonding apertures and the conducting wire pattern apertures. The conductive adhesive completely covers the conducting wire pattern exposed by the outer lead bonding apertures and the conducting wire pattern apertures of the insulation layer. The invention blocks moisture by using the conducting glue, and prevents the corrosion of the conducting wire pattern.

Description

【Technical field】 [0001] The present invention relates to a display panel and its control circuit packaging structure, in particular to a display panel and its control circuit packaging structure which uses conductive glue to block moisture and avoid corrosion of wire patterns. 【Background technique】 [0002] Driven by the demand for high-quality and thinner displays in the market, the packaging types of liquid crystal display panels are also developing towards high pin count and fine pitch. [0003] The liquid crystal display panel mainly includes an array substrate, a color filter substrate (CF substrate), and a layer of liquid crystal molecules disposed therein. Many metal wire patterns are arranged on the array substrate to provide the control circuit (driver IC) to transmit control signals, such as scanning signals, data signals or common electrode signals, to thin film transistors or common electrodes, thereby controlling the gray scale of the liquid crystal display pa...

AI Technical Summary

Problems solved by technology

[0007] As mentioned above, the main reason for the corrosion phenomenon of the metal wire pattern is that the sealing adhesive material of the metal wire pattern has insufficient moisture barrier ability. The packaging structure 30 only covers the outer pin joint opening 22, but does not cover other areas in the control circuit connection area 12, such as the second metal layer opening 24, in other words, the second gold layer opening 24. It is only covered with the transparent conductive layer 26, but the moisture barrier ability of the transparent conductive layer 26 is not good. To transmit a high potential signal (such as Vgh), and its adjacent wire is used to transmit a low potential signal (such as Vcom), whether it is the first metal layer pattern 14 or the second metal layer electrically connected to Pattern 18 is highly prone to corrosion problems

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