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Latent curing agent

A curing agent, potential technology, used in the field of thermosetting compositions, can solve problems such as incompatibility

Active Publication Date: 2008-01-30
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that it cannot be adapted to the low-temperature curing epoxy resin composition in recent years.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] 242.2 g of kerosene, 15 g of ethyl cellulose, and aluminum diisopropanol-sec-butoxide (AMD, Kenfain Chemical Co., Ltd.) 66% toluene solution 29.2g and silsesquioxane type oxetane derivative (OX-SQ-H, Toagosei Co.) 66% toluene solution 9.4g, while stirring The electric mantle heater heated until the temperature of the reaction solution reached 120° C., and further stirred at a temperature of 120° C. for 1 hour. Then, the reaction liquid was cooled to room temperature using an ice bath. As a result, a precipitate was formed. Next, the precipitate was collected by filtering the reaction solution, washed three times with heptane, and dried under reduced pressure to obtain 30.0 g of an aluminum alkoxide latent curing agent (yield 74%) as a white solid.

Embodiment 2

[0065] 264.1 g of kerosene, 15 g of ethyl cellulose, aluminum diisopropanol-sec-butoxide (AMD, Kawasaki 7.3 g of a 66% toluene solution of Kenfain Chemical Co., Ltd.) and 9.4 g of a 66% toluene solution of a silsesquioxane type oxetane derivative (OX-SQ-H, Toagosei Co., Ltd.) were used while stirring. Heating with a bell-type electric heater until the temperature of the reaction solution reaches 100°C, and when it reaches 100°C, add 50 g of an isocyanate compound (Coronet L45E, manufactured by Japan Polyuretan Industrial Co., Ltd.) to the reaction solution, and heat and stir at 100°C for 30 minutes . Next, 4.2 g of a 66% toluene solution of an alicyclic epoxy compound (CEL2021P, manufactured by Daicel Chemical Industry Co., Ltd.) was added, and stirred at 120° C. for 30 minutes to make it react. After 30 minutes, the reaction liquid was cooled to room temperature using an ice bath. As a result, a precipitate was formed. Next, the precipitate was collected by filtering the r...

Embodiment 3

[0067] Except for using 29.3 g of a 66% toluene solution of aluminum diisopropoxide-sec-butoxide (AMD, Kawaken Fine Chemical Corporation), the operation of Example 2 was repeated to obtain an aluminum alkoxide latent curing agent, It is light yellow solid.

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Abstract

The present invention provides an aluminum alkoxide latent curing agent capable of curing a thermosetting epoxy resin at a relatively low temperature in a short period of time. In addition, the present invention provides a method for producing an aluminum alkoxide-based latent curing agent, which can relatively easily control the curing conditions of the aluminum alkoxide-based latent curing agent. Aluminum alkoxide latent curing agent is formed by reacting silsesquioxane-type oxetane derivatives with aluminum alkoxide latent in the presence of water-insoluble or poorly water-soluble cellulose ether . The latent curing agent has a coating layer containing a water-insoluble or poorly water-soluble cellulose ether. The surface is preferably treated with an isocyanate compound.

Description

technical field [0001] The present invention relates to an aluminum alkoxide latent curing agent, a production method thereof, and a thermosetting composition containing the latent curing agent with good storage stability, wherein the aluminum alkoxide latent Curing agents can initiate curing of thermosetting compositions at relatively low temperatures. Background technique [0002] Thermosetting resin compositions such as epoxy resins are widely used as various adhesive materials, molding materials, etc., and latent imidazole-based curing agents are used as one of their curing agents. Since this latent imidazole type curing agent does not show curing ability in a normal storage state, it is widely used to make a thermosetting epoxy resin composition into a one-component type with good usability and good storage stability ( One-component type) curing composition. As a representative example of such a latent imidazole curing agent, a microcapsule type latent imidazole curin...

Claims

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Application Information

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IPC IPC(8): C08G59/40
CPCC08G59/62C08G59/40C08G59/4085C08G59/682C08G2261/59C08K5/5415C08L1/02C08L63/00
Inventor 小室胜彦川岛纠伊东雅彦增子大辅
Owner DEXERIALS CORP