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Latent curing agent

A latent curing agent, thermal curing technology, applied in the field of thermal curing compositions, can solve problems such as inability to adapt

Active Publication Date: 2008-05-28
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, there has been a problem that it cannot adapt to the low-temperature curing epoxy resin composition developed in recent years.

Method used

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Examples

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preparation example Construction

[0045] According to the preparation method of the present invention described above, by changing the type or amount of silsesquioxane type oxetane derivatives, or water-insoluble or poorly water-soluble cellulose ether, aluminum chelate The type or amount of use, reaction conditions, etc., can control the curing characteristics of the aluminum chelate latent curing agent. For example, if the reaction temperature is lowered, the curing temperature is lowered, and conversely, when the reaction temperature is raised, the curing temperature is raised.

[0046] The aluminum chelate-based latent curing agent of the present invention can be used in the same applications as the conventional imidazole-based latent curing agent, and it is preferable to use a silane coupling agent in combination with a thermosetting compound to obtain thermal curing with low-temperature rapid curing properties. type composition.

[0047] In the thermosetting composition, if the content of the aluminum c...

Embodiment A1

[0060] Add 159.7 g of kerosene, 10% ethyl acetate solution of ethyl cellulose, 10 g of aluminum chelate (ethyl acetoacetate diiso Aluminum propoxide; 9.1 g of 66% toluene solution of ALCH, produced by Kawaken Fine Chemical Co., 66% of silsesquioxane type oxetane derivative (OX-SQ-H, produced by Toagosei Co., Ltd.) 21.2 g of toluene solution and 0.04 g of silane coupling agent (A-1 87, Japan Unika), heated with a mantle heater, stopped heating when the temperature of the reaction solution reached 120 ° C, and cooled with an ice bath to room temperature. The result is a precipitate. Next, the reaction liquid was filtered, the precipitate was collected, the precipitate was washed three times with hexane, and dried under reduced pressure to obtain 9.9 g of an aluminum chelate latent curing agent as a white solid.

Embodiment A2

[0062] Except not using a silane coupling agent, it carried out according to Example A1, and obtained 10.0 g of aluminum chelate latent curing agents which are white solids.

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Abstract

The present invention provides an aluminum chelate latent curing agent capable of curing a thermosetting epoxy resin at a relatively low temperature and in a short period of time. The invention also provides a preparation method which can make the curing conditions of the aluminum chelate latent curing agent easier to control. The aluminum chelate latent curing agent reacts the silsesquioxane type oxetane derivative with the aluminum chelate in the presence of water-insoluble or poorly water-soluble cellulose ether to make it have potential. The latent curing agent has a coating layer containing a water-insoluble or hardly water-soluble cellulose ether. Preferably the surface is treated with an isocyanate compound.

Description

technical field [0001] The present invention relates to an aluminum chelate latent curing agent capable of initiating curing of a thermosetting composition at a relatively low temperature, a preparation method thereof, and a thermosetting composition containing the latent curing agent and having good storage stability. Background technique [0002] Thermosetting resin compositions such as epoxy resins are widely used as various adhesive materials and molding materials, and imidazole-based latent curing agents are often used as one of the curing agents. This imidazole-based latent curing agent does not show curing performance in a normal storage state, so the thermosetting epoxy resin composition can be made into a one-component curing composition with good handling properties and good storage stability, thereby be widely used. A representative example of the above-mentioned imidazole latent curing agent is known as a microcapsule latent curing agent obtained by covering the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08K5/5435C08L63/00
CPCC08K5/0091C08G59/70C08G59/4085C08G65/18C08G59/4007Y02E60/10C08K5/5435C08L63/00C08L1/08
Inventor 小室胜彦川岛纠伊东雅彦增子大辅
Owner DEXERIALS CORP