Polishing pad and method of producing the same

Abstract

The present invention is one kind of polishing pad and its making process. The polishing pad includes one pad body and one window embedded by means of chemical bond onto the pad body. It is made through setting colloid into one mold, injecting polishing pad material into the mold, curing the colloid to form one window during forming the polishing pad, and forming chemical bond between the polishing pad material and the window to obtain the polishing pad with waterproof window.

Description

technical field [0001] The invention relates to a polishing pad, in particular to a polishing pad with a waterproof window. Background technique [0002] In recent years, chemical mechanical planarization (chemical mechanical planarization, referred to as CMP) has been widely used in semiconductor processes. It flattens the surface of the wafer through the relative movement between the wafer and the polishing pad while the slurry is present and pressure is applied. change. Please refer to Fig. 1, it is the schematic diagram of CMP equipment, and the equipment of CMP is called grinder usually, and wafer 10 is placed under wafer support seat 12 in grinder, and the platform that is arranged opposite to wafer support seat A polishing pad 16 is placed on 14, and a slurry 18 is sprayed on the polishing pad by a slurry sprayer 20, and is interposed between the wafer and the polishing pad. [0003] There is usually a window on the polishing pad, and its purpose is to provide endpo...

AI Technical Summary

Problems solved by technology

[0005] The inventors of this case found that in the traditional polishing pad 110, there is only physical interaction between the window 100 and the polishing pad body 106 to combine the two, so the waterproof effect between the window and the polishing pad body is not good.

During the grinding process, the slurry will penetrate from the gap between the window and the polishing pad body to the bottom of the polishing pad, which will affect the bonding tape material between the polishing pad and the platform, and produce small air bubbles, resulting in the tightness between the polishing pad and the platform Poor and makes pad surface uneven

In this way, the CMP polishing effect of the wafer will be poor, and the desired planarization effect will not be achieved, which will lead to a decrease in the manufacturing yield or reliability of the components on the wafer.

[0006] Therefore, the industry urgently needs to improve the waterproof effect of the polishing pad window to prevent the slurry from penetrating between the polishing pad and the platform, resulting in poor wafer polishing effect

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