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Module power supply base pin structure

A technology of module power supply and pin structure, applied in the direction of electrical equipment structural parts, electrical components, electrical solid devices, etc., can solve problems such as poor overcurrent capability and poor mechanical connection strength, and achieve improved production efficiency and enhanced mechanical strength. , the effect of good overcurrent capability

Inactive Publication Date: 2008-03-05
YIBO POWER SUPPLY CO LTD HANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The full surface mount pin is opposite to the separated through-hole pin, which can effectively overcome the shortcomings of the latter, but loses its advantages. It occupies less PCB board resources, can be produced by SMT technology, and has high assembly efficiency, but it is too Relatively poor current capability, poor mechanical connection strength

Method used

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  • Module power supply base pin structure
  • Module power supply base pin structure
  • Module power supply base pin structure

Examples

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Embodiment Construction

[0023] Referring to Fig. 3(A), the perforated pin 101 has a first mounting head 201, a first step 202, a V-shaped anti-tin groove 203, a V-shaped anti-slip groove 204, a second step 205 and a second mounting head 206. . Mounting head 201 and mounting head 205 each have inverted feet to facilitate alignment and assembly. The length of mounting head 201 can be smaller than the thickness of the module power supply PCB to be suitable for SMT process production. Referring to FIG. 3(B), an embodiment of the surface mount pin 102 has a first soldering surface 211, a V-shaped anti-tin groove 212, a V-shaped anti-skid groove 213, a step 214, and a mounting head 215. Referring to Fig. 3 (C), another embodiment of the surface mount type pin 102 is different from the embodiment of Fig. 3 (B) in that the step 214 and the mounting head 215 are replaced by the second soldering surface 217 to form another A surface mount pin 102-1. Both the first soldering surface 211 and the second solderi...

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Abstract

This invention discloses a pin structure component of a module supply including a punch pin, a surface pasted pin and high temperature insulation piece characterizing that the insulation piece locates the pins according to the pin position definition of module supply industrial standard to get the component, which has the advantages of punch pins and total surface pasted pins, and the punch one used for the supply input and output is good in flowing current and a fixed mechanical connection strength, and the surface pasted pin used for assistant function pins occupies less resource of PCB and two of which are combined to one unit after plastic package to strengthen the mechanical strength.

Description

technical field [0001] The present invention relates to modular power supplies, and more particularly to pinouts of brick-type modular power supplies having an industry standard package. Background technique [0002] The power density of the current module power supply is getting higher and higher. The improvement of power density largely depends on the progress of technology, the performance development of components, and also benefits from the improvement of heat dissipation and packaging structure. Industrial standard brick power pins are usually fully separated and through-hole, see Figure 1; in recent years, there are also pins that are fully surface-mounted (SMT), see Figure 2. Fully separated perforated pins have good overcurrent capability and strong mechanical connection strength, but such pins need to provide through holes for installation and occupy more printed circuit (PCB) board resources. Other electronic components cannot be installed; and such pins cannot ...

Claims

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Application Information

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IPC IPC(8): H01R13/04H01R4/02H01R13/405H05K7/00H01L23/48
Inventor 唐钊茹彩忠
Owner YIBO POWER SUPPLY CO LTD HANGZHOU
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