The invention discloses a method for implementing increase of current capacity by a common circuit board in the technical field of battery management. The method comprises the following steps of: S1,selecting a specification
copper foil, and windowing on the surface of the
copper foil to form a dense
net shape; S2, uniformly
coating solder paste on each node of the net-shaped
copper foil, and carrying out inclined connection to form an inclined
solder paste network; S3, carrying out furnace passing
processing on the
copper foil coated with the
solder paste, so that after being molten, the solder paste is shrunk and automatically absorbed on the windowed net-shaped
copper foil; and S4, carrying out
processing repair on the
copper foil subjected to furnace passing
processing so as to form solder
webbing with a uniform thickness. According to the invention, when the solder paste passes through a furnace, the solder paste is automatically shrunk after being molten and can be absorbed ontothe windowed net-shaped copper foil to form the solder
webbing with the uniform thickness,
soldering tin is not
cut off after being solidified and the
soldering tin is large in thickness, so that
overcurrent capacity of the copper foil is increased by multiple times; and moreover, according to the method, production steps are not increased, generated benefits are huge, and the defect of excessively low
overcurrent capacity of a common copper foil is overcome.