4results about How to "Improve overcurrent capability" patented technology

This application relates to the field of metal film capacitor technology, and provides an end-plate type high-current metal film capacitor for PCB circuit boards, including a housing, a core, end plates, and potting compound. The core is installed in the internal cavity of the housing, and the potting compound fills the remaining area of ​​the internal cavity of the housing. End plates are welded to both end faces of the core, and the outer surfaces of all end plates are in close contact with the corresponding inner walls of the housing. The upper part of the end plate is bent and supported on the corresponding positioning groove. Positioning protrusions are provided at both ends of the end plate, and the positioning protrusions are embedded in the corresponding positioning grooves. The width of the positioning grooves is the same as the width of the positioning protrusions. The end plates adopt a two-piece structure with the same polarity. The core is made of metallized polypropylene film wound together. The coating of the metallized polypropylene film is a mesh safety film with a diamond pattern design. The tops of all end plates are exposed on the upper surface of the potting compound. This application can control the capacitance decay rate and extend the product life.

The utility model provides a kind of power module and motor controller, power module is applicable to motor controller, power module includes drive board, connecting assembly, sensing component and power assembly;Connecting assembly is connected with drive board, to input or output current to drive board by connecting assembly;Sensing component is connected by drive board with connecting assembly, to be used for detecting whether there is current on connecting assembly;Power assembly is installed on drive board, and power assembly includes heat dissipation component and multiple chips connected with heat dissipation component, the opposite sides of heat dissipation component all have installation shell, and multiple chips are respectively arranged on corresponding installation shell with interval, to carry out heat dissipation to multiple chips by heat dissipation component, to solve the problem of low heat dissipation efficiency of power module in motor controller in prior art.

The invention discloses a driving circuit, a driving method and driving equipment of a switch assembly and a storage medium. The switch assembly comprises an MOS (Metal Oxide Semiconductor) and an IGBT (Insulated Gate Bipolar Translator), the driving circuit comprises a microcontroller which is respectively connected to a grid electrode of the MOS and a grid electrode of the IGBT, and the microcontroller is configured to control the MOS to be switched on and control the IGBT to be switched off when a working current is smaller than a first current threshold value, so that the working current passes through the MOS; when the working current is larger than or equal to the first current threshold value and smaller than the second current threshold value, the MOS is controlled to be firstly switched on and then switched off relative to the IGBT, so that the working current passes through the MOS and the IGBT which are connected in parallel; and when the working current is greater than or equal to the second current threshold value, controlling the IGBT to be switched on firstly and then switched off relative to the MOS, so that the working current passes through the MOS and the IGBT which are connected in parallel. According to the driving circuit of the switch assembly, different driving modes are implemented according to different current ranges of the working current, the switch device is protected, and the working efficiency of the switch device is improved.

The utility model discloses a connector pin, a jack contact element and a connector terminal assembly, the connector pin comprises a first plugging part, a second plugging part and a first connecting part, the second plugging part is connected to the first plugging part, the first connecting part is connected to one end, deviating from the first plugging part, of the second plugging part, and the second plugging part is connected to the jack contact element. The first plugging part and the second plugging part are arranged along the axial direction of the connector pin, and the first plugging part and / or the second plugging part can elastically deform in the radial direction. The jack contact element comprises a first contact part, a second contact part and a second connecting part, the second contact part is connected to one end of the first contact part, the second connecting part is connected to one end, deviating from the first contact part, of the second contact part, and the connector pin is inserted into the jack of the jack contact element; the connector pin is in elastic contact with the second contact part, and the connector pin is in elastic contact with the first contact part.