Method for implementing increase of current capacity by common circuit board

Abstract

The invention discloses a method for implementing increase of current capacity by a common circuit board in the technical field of battery management. The method comprises the following steps of: S1,selecting a specification copper foil, and windowing on the surface of the copper foil to form a dense net shape; S2, uniformly coating solder paste on each node of the net-shaped copper foil, and carrying out inclined connection to form an inclined solder paste network; S3, carrying out furnace passing processing on the copper foil coated with the solder paste, so that after being molten, the solder paste is shrunk and automatically absorbed on the windowed net-shaped copper foil; and S4, carrying out processing repair on the copper foil subjected to furnace passing processing so as to form solder webbing with a uniform thickness. According to the invention, when the solder paste passes through a furnace, the solder paste is automatically shrunk after being molten and can be absorbed ontothe windowed net-shaped copper foil to form the solder webbing with the uniform thickness, soldering tin is not cut off after being solidified and the soldering tin is large in thickness, so that overcurrent capacity of the copper foil is increased by multiple times; and moreover, according to the method, production steps are not increased, generated benefits are huge, and the defect of excessively low overcurrent capacity of a common copper foil is overcome.

Description

technical field [0001] The invention relates to the technical field of battery management, in particular to a method for increasing the current capacity of an ordinary circuit board. Background technique [0002] In new energy applications, large current control capability is a common requirement. The power part of the circuit requires high power, but the overcurrent capability provided by the thickness of the copper foil of the circuit board is limited, which cannot meet the high power requirement. [0003] The high current on the existing circuit board will cause the copper foil to heat up, shorten the life, and even cause the temperature of the copper foil to be too high, oxidized and blown, which cannot meet the needs of high-current products. Most of the solutions are to expand the width of the copper foil and increase the thickness of the copper foil, but the increase in width and thickness is limited and cannot be greatly increased. Another solution is to tin-plate t...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for increasing the current capacity of an ordinary circuit board, so as to solve the problem that the large current on the existing circuit board proposed in the above background technology will cause the copper foil to heat up, shorten the service life, and even cause the copper foil If the temperature is too high and the oxidation fuses, it cannot meet the needs of high-current products.

Images