Packaging method of intelligent power module and intelligent power module

A technology of intelligent power modules and packaging methods, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of insufficient current carrying capacity and high stray inductance, so as to prevent the influence of high temperature and reduce stray inductance , Solve the effect of high stray inductance

Pending Publication Date: 2019-08-13
EDGELESS SEMICON CO LTD OF ZHUHAI
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  • Abstract
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Problems solved by technology

[0004] The embodiment of the present invention provides a packaging method of an intelligent power module and an intelligent power module, so as to at least solve the technical problems of high stray inductance and insufficient current carrying capacity caused by the electrical connection of the traditional intelligent power module by wire bonding

Method used

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  • Packaging method of intelligent power module and intelligent power module
  • Packaging method of intelligent power module and intelligent power module

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0029] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circ...

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Abstract

The invention discloses a packaging method of an intelligent power module and the intelligent power module. The method comprises the steps: carrying out the conductive paste printing on the outer surface of a first resin layer after the intelligent power module completes first resin layer packaging, wherein a power chip in the intelligent power module is arranged in the first resin layer; and carrying out second resin layer packaging on the intelligent power module printed by the conductive paste to obtain a packaged and formed intelligent power module, wherein a driving chip of the intelligent power module is placed in the second resin layer. The technical problems that a traditional intelligent power module is electrically connected in a lead bonding mode, so that stray inductance is high, and the current bearing capacity is insufficient are solved.

Description

technical field [0001] The invention relates to the field of packaging without welding wires, in particular to a packaging method for an intelligent power module and the intelligent power module. Background technique [0002] In the related technology, due to the large overcurrent of the intelligent power module and the large heat generation of the power chip, the traditional intelligent power module is electrically connected by wire bonding, which will lead to high stray inductance and fatigue damage at the solder joints of the bonding wires. , Insufficient current carrying capacity, low bonding efficiency and other issues. At the same time, in the traditional intelligent power module, the driver chip IC is placed near the switch chip IGBT. Due to the poor high temperature resistance of the driver chip IC, it will cause interference and distortion of the driving signal. [0003] For the above problems, no effective solution has been proposed yet. Contents of the inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/31H01L25/065
CPCH01L21/56H01L23/3114H01L25/0652H01L2224/18H01L2224/73267H01L2224/04105H01L2224/24137H01L2224/32225
Inventor 敖利波史波曾丹刘勇强陈兆同
Owner EDGELESS SEMICON CO LTD OF ZHUHAI
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