Flexible multi-layer circuit board and its producing method
A multi-layer circuit and manufacturing method technology, applied in multi-layer circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of shrinking the usable area of flexible multi-layer circuit boards, occupying the surface area of circuit boards, and increasing the deviation rate, etc. Achieve the effects of reducing the probability of derivative short circuit or open circuit, improving the stability of line connection, and reducing the number of contacts
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[0024] Described in the detailed description is a flexible four-layer circuit board and its manufacturing method.
[0025] The four-layer flexible multilayer circuit board includes a blind hole H1 connecting the three-layer circuit board and a through hole H2 penetrating the four-layer circuit board. The blind hole H1 and the through hole H2 are marked in Fig. 2 to Fig. 9 . The position of the blind hole H1 is determined according to the wiring requirements of the circuit board in practical applications.
[0026] The method for manufacturing the four-layer flexible multilayer circuit board will be described below.
[0027] Referring to FIG. 2 to FIG. 10 , firstly, in FIG. 2 , the steps of forming and laminating a protective film for an inner layer circuit are laminated with protective layers 703 and 704 on both sides of copper foil 903 . In Fig. 3, one prepreg is pasted on both sides of the protective film 703, 704 and the substrate 702, 704 (polyimide resin), and two prepreg...
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