Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated

A technology for semiconductors and wafers, which is used in the field of testing semiconductor wafers and devices using temperature-adjustable chuck equipment, which can solve problems such as chip heating and electrical failures, and achieve rapid response effects

Active Publication Date: 2011-06-08
ERS ELECTRONICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, at relatively high power, it is possible to heat the chip above the maximum allowable temperature, which creates a risk of electrical failure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated
  • Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated
  • Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] figure 1 A schematic diagram of an embodiment of an apparatus for testing a semiconductor wafer using a temperature adjustable clamping apparatus according to the invention is shown.

[0025] exist figure 1 In , reference numeral 1 denotes a temperature-adjustable clamping device that can move in a vertical direction and in a plane.

[0026] The clamping device 1 has an upper region 1 a with a vacuum groove 50 . On the upper region 1 a of the clamping device 1 there is a semiconductor wafer 5 , the rear side R of which is in contact with the supporting surface AF of the clamping device 1 .

[0027] In the central region 1 b of the clamping device 1 there is an electrical heating device HE provided for heating the clamping device 1 by supplying electrical power PW.

[0028] Finally, in the lower zone 1c of the clamping device 1 there is a labyrinth cooling channel system 11c to which a precooling fluid F of input temperature Tin is supplied at input 11a and cooled f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a method for testing semiconductor wafers ( 5 ) by means of a temperature-regulated chuck device ( 1 ), comprising the following steps: controlling the temperature of the chuck device ( 1 ) to a predetermined measurement temperature by means of a heating device (HE) having a predefined heating power (PW) and a cooling device ( 11 a, 11 b, 11 c) having a predefined cooling capacity (PK), the heating power (PW) being substantially greater than a predefined testing power (PT); laying the rear side (R) of a semiconductor wafer ( 5 ) on a supporting side (AF) of the temperature-regulated chuck device ( 1 ); placing a probe card ( 7', 7' a) on the front side (O) of the semiconductor wafer ( 5 ); testing the semiconductor wafer ( 5 ) by impressing the testing power(PT) from a testing apparatus (TV) into a chip region (CH) of the front side (O) of the semiconductor wafer ( 5 ) by means of probes ( 91, 92 ) of the probe card ( 7', 7' a) placed on; reducing the heating power (PW) by the amount of the testing power (PT) during the testing with a substantially constant cooling capacity (PK). The invention also provides a corresponding apparatus.

Description

technical field [0001] The present invention relates to a method and apparatus for testing semiconductor wafers using a temperature adjustable chuck apparatus (hereinafter referred to as clamping apparatus). Background technique [0002] As is known, experimental measurements on semiconductor wafers are typically performed in a temperature range between -60°C and +400°C. For temperature control purposes, the semiconductor wafer is placed on a probe test station or clamping device which is cooled and / or heated according to the desired temperature. [0003] In this case, it is first necessary to take care that the temperature of the semiconductor wafer does not drop below the dew point of the surrounding gaseous medium, otherwise condensation or freezing of water vapor will occur on the surface of the semiconductor wafer, thereby hindering or making the test measurement impossible. [0004] Second, in the case of experimental measurements using high chip power, a problem aris...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00G01R31/28
CPCH01L21/683G01R31/2874H01L22/00
Inventor 埃里希·赖廷格
Owner ERS ELECTRONICS