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Interposer

A technology for relay substrates and substrates, which is applied in the directions of coupling devices, conductive connections, electrical components, etc., can solve the problems of complicated processes and increased manufacturing costs, and achieve the effects of easy manufacturing, reduced manufacturing costs, and easy rewiring.

Inactive Publication Date: 2008-03-05
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional configuration of rewiring the electrodes between the two by using the technology of the multilayer substrate has the problems of complicated process and high manufacturing cost.

Method used

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Embodiment Construction

[0037] FIG. 1 is a perspective view showing the appearance of a relay substrate as an embodiment of the present invention. FIG. 1A is a case where the relay substrate is viewed from one direction, FIG. 1B is a case where the relay substrate is viewed from the opposite direction, and FIG. 2 is shown in FIG. 1 An exploded perspective view of the relay substrate, FIG. 3 is a perspective view showing a spiral contact as an example of an elastic contact, and FIG. 4 shows an example of use of the relay substrate, and is a cross-sectional view taken along line 4-4 in FIG. 1A.

[0038] As shown in FIGS. 1A and B, the relay substrate 10 has a rod shape extending linearly along the Y1 and Y2 directions shown in the figure. The relay substrate 10 has a spacer 11 that functions as a base, and a base sheet (base material) 12 attached to the surface of the spacer 11.

[0039] The spacer 11 is formed in a rod shape, and an arc-shaped curved surface 11a is formed on at least one side surface in t...

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PUM

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Abstract

[PROBLEMS] To provide an interposer capable of connecting electrodes of an electronic part with simple structure without requiring formation of a through hole. [MEANS FOR SOLVING PROBLEMS] Elastic contacts (20A, 20B) are formed in an elastic contact formation area A while contacts (14A, 14B) are formed in a contact formation area B on a substrate sheet (12). The substrate sheet (12) is folded at the portion between the two types of contacts in a folding area C along an outer shape of a spacer (11). The connection between the elastic contact (20A) and the contact (14A) and the connection between the elastic contact (20B) and the contact (14B) are made by connection lines formed on the substrate sheet (12). Accordingly, when the interposer (10) is mounted on a mounting unit (31) of a device body (30) and an electronic part (40) is mounted thereon before closing the cover, it is possible to connect the electrodes (32, 33) of the device body (30) to the electrodes (41, 42) of the electronic part (40), respectively. Thus, it is possible to connect electrodes of the electronic part with a simple structure without forming a through hole.

Description

Technical field [0001] The present invention relates to, for example, a relay substrate for ensuring electrical connection between the electrodes of electronic components arranged opposite to each other, and more particularly to a relay substrate that can be easily manufactured with a simple configuration. Background technique [0002] In recent years, with the development of multi-functional and high-performance semiconductor integrated circuits (IC), the number of input and output pins of IC packages (hereinafter referred to as "packages" as appropriate) sealed with semiconductor bare chips has been increasing year by year Trends, for example, devices with more than 1,000 pins are beginning to appear. [0003] Therefore, the type of input and output pins has changed from the conventional way of taking out from the two or four sides of the package to the way of taking out from the entire bottom of the package. For example, the development of BGA (Ball Grid Array, ball contact te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01
CPCH01R12/79H01R12/7082H01R12/52H01R23/6886H01R13/2421H05K3/40
Inventor 吉田信冈本泰志樋口知行
Owner ALPS ALPINE CO LTD