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Picker and head assembly with the pickers

A technology of head components and pickers, which is applied in semiconductor/solid-state device manufacturing, collets, electrical components, etc., can solve the problems of increasing the size of the picker, increasing the size, etc., and achieve the effect of reducing operation time

Inactive Publication Date: 2008-03-26
MIRAE CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This increases the size of the cylinder block 60 and thus the size of the pickup equipped with the cylinder block 60

Method used

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  • Picker and head assembly with the pickers
  • Picker and head assembly with the pickers
  • Picker and head assembly with the pickers

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0032] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0033] FIG. 2 is an exploded view showing the pickup 100 according to an embodiment of the present invention. FIG. 3 is a perspective view showing the pickup 100 . FIG. 4 is a cross-sectional view showing the pickup 100 . As shown in FIGS. 2 to 4, a pickup 100 according to an embodiment of the present invention includes: a pickup base 110; a base block 120; a nozzle assembly 130; an air pressure supply unit (not shown), supplying negative or positive pressure a plurality of first mechanisms 140 through which negative or positive pressure is supplied to the nozzles; and a plurality of second mechanisms 150 each moving each nozzle assembly up and down.

[0034] The picker 100 picks up the packaged chips from the load memory 310 and places the packaged chips into the unload memory. Two or more pickers 100 are arranged in a...

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PUM

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Abstract

Provided is a picker for transferring packaged chips, including a picker base, a base block fixably connected to the picker base, a plurality of nozzle assemblies, provided to the base block, each nozzle assembly being movable up and down, and having a nozzle which a packaged chip is held against or released from by air pressure, an air pressure supplying unit supplying negative or positive pressure by which the packaged chip is held against or released from the nozzle, a plurality of first mechanisms, through each of which the negative or positive pressure is supplied to the nozzle; and a plurality of second mechanisms, each of which moves up and down each of nozzle assemblies.

Description

technical field [0001] The present invention relates to a picker for conveying packaged chips and a head assembly with the picker for use in a handler. Background technique [0002] At the end of the packaging process, the handler subjects the packaged chips to a series of environmental, electrical, and reliability tests. These tests vary in type and specification depending on the consumer and use of the packaged device. For a large number of chips, these assays can be performed on all chips, or they can be performed on selected samples. [0003] The handler places the packaged chips into the inspection tray, and feeds the inspection tray into the detector. The tester includes a tester board with multiple sockets for electrical testing on the packaged chip. The packaged die is connected to the socket of the test board for electrical testing. The handler puts the packaged chips into the inspection tray, ie, jigs, and connects the packaged chips accommodated in the inspect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91B25J15/06H01L21/683G01R31/28
CPCH05K13/0408H05K13/0413H05K13/0409H05K13/041H05K13/02
Inventor 安正旭金善活崔完凞许情
Owner MIRAE CORPORATION