Semiconductor package structure and manufacture method thereof

Abstract

The semiconductor encapsulation structure comprises: a wire carrier, a chip, an encapsulation gel and a passive component located at the external pin area and the one of the support leg of the wire carrier; wherein, the passive3 component is exposed from the sealing gel; after the chip is encapsulated, the passive component is configured.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, in particular to a semiconductor packaging structure with passive components and a manufacturing method thereof. Background technique [0002] With the advancement of semiconductor process technology and the increasing density of integrated circuits, there are more and more pins in the structure of components, and the requirements for speed are getting faster and faster, which makes the production of small, fast and high-density structure components Has become a trend. [0003] As the construction speed of electronic packages increases, noise from DC power lines and ground lines has gradually become a problem that cannot be ignored. Therefore, passive components, such as capacitance, are generally used to reduce power supply noise. figure 1 A cross-sectional view of a semiconductor package structure with passive components in the prior art is shown, which includes a lead frame 100 , a chi...

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Problems solved by technology

[0004] However, in the above packaging structure, after the chip 200 and the passive component 300 are packaged, the electrical test is performed. The package body 400) must be scrapped, resulting in waste of production cost and time

On the other hand, when inspecting packages with poor electrical properties, because of the sealed structure, it is difficult to detect the cause of electrical failure inside the package, so it is difficult to improve the pass rate with the original structure

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