Image input device

Abstract

The present invention relates to an image detection device used for detecting finger tip images by guiding light omitted from a light-emitting element to irradiate finger tips and inputting into a camera shooting element by means of an image guiding part for guiding light from the finger tips, and the objective of the invention is to provide an image input device capable of improving illuminating efficiency, reducing electric consumption and improving assembly performances at the same time and method for manufacturing same.In accordance with the present invention, the image input device for irradiating a camera shooting object through light omitted by the light-emitting element (122, 123) and shooting light from the camera shooting object by means of a camera (113, 114) is characterized in that the device comprises the light-emitting element (122, 123) mounted on an auxiliary substrate (121), an illumination module (112) formed by executing a resin model shaping on the light-emitting element (122, 123), and a main substrate (111) provided with the camera (113, 114) and the illumination module (112).

Description

technical field [0001] The present invention relates to an image input device, in particular to a device that irradiates the light emitted by a light-emitting element onto a fingertip, and inputs the light from the fingertip into the imaging element by means of an image guiding component that guides the light to detect An image input device that outputs fingertip images. Background technique [0002] In recent years, security has been required to be improved in the field of information communication. Accordingly, it is required to mount sensors for biometric authentication on electronic devices such as computers and portable communication devices such as mobile phones. As a sensor for biometric authentication, attention has been paid to a scan-type fingerprint sensor that can be miniaturized. [0003] As a scanning fingerprint sensor, a fingerprint sensor has been proposed, which is constructed as follows: an image guide member composed of an optical fiber bundle is arrang...

AI Technical Summary

Problems solved by technology

[0010] Furthermore, since the light guide block 13 is fixed to the light-emitting element 12 through the light-transmitting adhesive 17, if the amount of the light-transmitting adhesive 17 applied is insufficient and voids or the like are generated, the light-shielding resin 16 mold When it is molded, the light-shielding resin 16 will penetrate into the gap, resulting in light-shielding, and cannot supply sufficient light to the fingertip 20.

In addition, when heat or the like is applied, the void expands, and there is a possibility that the light-emitting element 12 may be destroyed.

[0011] In addition, when a thermoplastic transparent molding resin is used for the light guide block 13, since the heat resistance is low, in the case of heat treatment such as solder reflow, the light guide block 13 is deformed, and the solder reflow cannot be performed. heat treatment

Therefore, it is necessary to apply a special treatment that can be completed without heating or low-temperature heating, and there are problems such as high cost.

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