Method for preparation of multi-layer flexible circuit board

Abstract

The invention relates to a method of manufacturing a multi-layer flexible circuit plate, comprising the following steps: at least three pressing plates covered with copper layers and a plurality of binding layers are provided, and the pressing plate covered with copper layers comprises a insulation layer and a conductive circuit which is formed on the surface of the insulation layer; the at least three pressing plates covered with copper layers and a plurality of binding layers are laminated and aligned, and a binding layer is arranged in the middle of the neighboring two pressing plates of the at least three pressing plates covered with copper layers; a pressing mechanism is used for pressing the at least three pressing plates covered with copper layers and a plurality of binding layers to obtain the multi-layer flexible circuit plate. The method of manufacturing a multi-layer flexible circuit plate can shorten the processing time, enhance the quality stability and reduce the short circuit or bad open circuit.

Description

technical field [0001] The invention relates to a method for preparing a circuit board, in particular to a method for preparing a flexible circuit board. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, FPCB) is widely used in various electronic products with relative movement between components during operation to provide power / signal transmission due to its excellent flexural resistance. For example, in folding mobile phones, printing heads, and hard disk reading heads. The trend of miniaturization of electronic products makes multi-layer flexible circuit boards gradually replace single-layer or double-layer flexible circuit boards. [0003] Figure 4 to Figure 6 It is a schematic diagram of a typical multilayer flexible circuit board manufacturing method. refer to Figure 4 , providing copper-clad laminates 41, 42 and an adhesive layer 45. The copper clad laminate 41 includes an insulating layer 411 and a conductive circuit...

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Problems solved by technology

[0006] However, the above method for preparing a multi-layer flexible circuit board has the following disadvantages: firstly, it includes multiple pressing steps, so the manufacturing process takes a long time; There is a large deviation between the lines between the layers and the pre-design. When the via hole is prepared after the lamination is completed, the deviation of the line may cause a short circuit or an open circuit, and the quality of the flexible circuit board is unstable.

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