Magnetic sensor and manufacturing method thereof

A manufacturing method and magnetic sensor technology, applied in the manufacture/processing of electromagnetic devices, instruments, and measuring magnetic variables, etc., can solve the problems of complicated sensor production, high sensor price, trouble, etc.

Inactive Publication Date: 2008-06-18
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] However, the above-mentioned three-dimensional magnetic sensor needs to install two chips consisting of the A chip and the B chip in the package assembly, so this sensor has problems such as complicated and troublesome fabrication.
Moreover, due to the need to use special packaging components, this sensor has the problem of high price and difficulty in miniaturization

Method used

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  • Magnetic sensor and manufacturing method thereof
  • Magnetic sensor and manufacturing method thereof
  • Magnetic sensor and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0201] First, the three-axis magnetic sensor of Embodiment 1 will be described with reference to FIGS. 1A to 15C .

[0202] The three-axis magnetic sensor 10 of Embodiment 1, as shown in FIGS. 1A and 1B , has a rectangular shape (here, the short side ( The ratio (aspect ratio) of the longitudinal side) to the long side (transverse side) is 1:2, and the side extending along the X-axis is the long side, and the side extending along the Y-axis is the short side), and is configured with A substrate 11 made of quartz or silicon with a relatively small thickness in the Z-axis direction perpendicular to the X-axis and the Y-axis. On the substrate 11, a total of twelve GMR elements consisting of four X-axis GMR elements 21-24, Y-axis GMR elements 31-34, and Z-axis GMR elements 41-44 are formed, and a total of There are twelve pads (not shown in the figure) and connection lines (not shown in the figure) connecting each pad to each element. Moreover, in this substrate 11, LSI (Large S...

Embodiment 2

[0252] Next, the three-axis magnetic sensor of the second embodiment will be described with reference to FIGS. 17A to 20C.

[0253] The three-axis magnetic sensor 60 of Embodiment 2, as shown in FIGS. 17A and 17B , has a rectangular shape with sides extending in the X-axis direction and the Y-axis direction orthogonal to each other in plan view (here, the short sides (longitudinal sides) ) to the long side (lateral side) ratio (aspect ratio) is 1:1.5, and the side extending along the X-axis is the long side, and the side extending along the Y-axis is the short side), and is configured with The substrate 61 made of quartz or silicon has a relatively small thickness in the direction of the Z axis perpendicular to the Y axis. With the substrate 61 having such a structure, further miniaturization than that of the three-axis magnetic sensor of Embodiment 1 can be achieved.

[0254] On this substrate 61, a total of twelve GMR elements including four X-axis GMR elements 61a to 61d, ...

Embodiment 3

[0280] Next, the three-axis magnetic sensor of the third embodiment will be described with reference to FIGS. 21A to 24B .

[0281] The three-axis magnetic sensor 70 of Embodiment 3, as shown in FIGS. 21A and 21B , has a square shape (that is, the size is about half of the substrate 11 in the above-mentioned Embodiment 1), and has X axes orthogonal to each other in a plan view. The side extending in the X-axis and the Y-axis direction, and a substrate 71 made of a quartz substrate or silicon having a relatively small thickness in the Z-axis direction perpendicular to the X-axis and the Y-axis is arranged. With the substrate 71 having such a structure, it is possible to achieve further miniaturization than the three-axis magnetic sensor of the first embodiment and the three-axis magnetic sensor of the second embodiment.

[0282] A total of ten GMR elements including four X-axis GMR elements 71a to 71d, Y-axis GMR elements 71e to 71h, and two Z-axis GMR elements 71i and 71j are ...

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Abstract

A 3-axis magnetic sensor includes a magnetoresistive element formed by a plurality of magnetoresistive element bars connected in series by a bias magnet. The magnetoresistive element of the X-axis sensor and the magnetoresistive element of the Y-axis sensor are formed on a plane parallel to the surface of the substrate. The magnetization sensitivity direction vertical to the longitudinal direction of each of the magnetoresistive element bars. The magnetization direction of the magnetoresistive element of the X-axis sensor orthogonally intersects that of the magnetoresistive element of the Y-axis sensor. Furthermore, the magnetoresistive element of the Z-axis sensor is formed on the inclined surface of the protrusion protruding from the surface of the substrate and its magnetization direction is in the inclined surface. The magnetization sensitivity direction of the Z-axis sensor is vertical to the longitudinal direction of the magnetoresistive element bar.

Description

technical field [0001] The present invention relates to a three-axis magnetic sensor and a manufacturing method thereof. In the three-axis magnetic sensor, an X-axis sensor formed by bridging a plurality of magnetoresistance effect elements and an X-axis sensor formed by bridging a plurality of magnetoresistance effect elements are arranged in one substrate. Y-axis sensor, Z-axis sensor formed by bridging multiple magnetoresistive effect elements. [0002] This application claims priority from the following applications, the contents of which are made a part of this application by reference. [0003] Japanese Patent Application No. 2005-77010 filed on March 17, 2005 [0004] Japanese Patent Application No. 2005-90581 filed on March 28, 2005 [0005] Japanese Patent Application No. 2005-91256 filed on March 28, 2005 [0006] Japanese Patent Application No. 2006-32124 filed on February 9, 2006 [0007] Japanese Patent Application No. 2006-32125 filed on February 9, 2006 Ba...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R33/09H01L43/12
Inventor 佐藤秀树大村昌良内藤宽大桥俊幸涌井幸夫大须贺千寻
Owner YAMAHA CORP
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