Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit
A technology for electronic components installation and electronic components, which is applied in the direction of removing conductive materials by mechanical methods, can solve the problems of incorrectly adjusting the distribution of mutual relations, and cannot measure the precise height of electronic components, and achieve the effect of improving installation accuracy
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no. 1 example
[0084] refer to figure 1 The schematic plan view of the electronic component mounting apparatus 100 shown in , describes the general structure of the electronic component mounting apparatus according to the first embodiment of the present invention. Such as figure 1 As shown, the transfer rail 2 is placed in the approximate center of the base 1 . The conveyance rail 2 is an example of a board conveyance and positioning unit for conveying a board (circuit board) 3 as a mounting target on which electronic components are to be mounted, and positioning the board at a prescribed position on the chassis 1 . In the first embodiment, it is assumed that the conveyance direction of the board 3 is the X direction, and the direction orthogonal thereto in the horizontal plane is the Y direction.
[0085] In addition, if figure 1 As shown, the component feeding unit 4 is placed on both sides of the conveying rail 2 along the Y direction, and a plurality of tape feeders 5 are movably arra...
no. 2 example
[0140] The present invention is not limited to the aforementioned first embodiment, and can be realized in other various modes. For example, although the electronic component mounting apparatus according to the second embodiment of the present invention includes a sensor unit substantially similar in structure to the sensor unit 20 of the first embodiment, it tends to detect components by utilizing a technique different from that of the first embodiment. height to further improve detection accuracy. Therefore, in the following description, constituent members having the same structure as those of the sensor unit 20 of the first embodiment are denoted by the same reference symbols, and descriptions thereof are omitted.
[0141] First, in Figure 11 A schematic configuration diagram showing the configuration of the sensor unit 220 is shown in , as an example of the component height detection unit included in the electronic component mounting apparatus of the second embodiment. ...
no. 3 example
[0166] Next, as a third embodiment of the present invention, refer to Figure 15 and 16 The schematic exemplary diagram shown in , explains the optical axis adjustment method for the sensor unit included in the electronic component mounting apparatus of the first or second embodiment.
[0167] This optical axis adjustment in the sensor unit 20 (or sensor unit 220) is performed by adjusting the position or inclination of the beam projector 21 and the beam receiver 22 so as to set a state in which the beam projector 21 substantially The horizontally projected laser beam Q is completely received by the beam receiver 22, that is, a state in which the laser beam passes through the entire hole portion of the receiving side hole plate 22a of the beam receiver 22, so that a designated light receiving spot can be received by the beam receiver 22 diameter of the laser beam.
[0168] More specifically, first as Figure 15 As shown, the optical filter 89 is placed on the optical axis b...
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