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Thermoforming apparatus

A thermoforming and forming surface technology, which is applied in the field of thermoforming devices, can solve problems such as difficult operations and achieve the effect of reducing costs

Inactive Publication Date: 2010-05-26
ASANO LABORATORIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When changing the mold in the above-mentioned equipment, since it is necessary to remove the mold fixed in the equipment and install other molds in the thermoforming equipment, the work is not easy and takes a lot of time.

Method used

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Embodiment Construction

[0128] Hereinafter, embodiments of the present invention will be described in the following order.

[0129] (1) Description of the thermoforming device;

[0130] (2) The function of thermoforming device;

[0131] (3) Variations.

[0132] (1) Description of thermoforming device:

[0133] figure 1 is a perspective view showing the thermoforming apparatus 100, figure 2 is a front view showing the forming mechanism 20, image 3 as well as Figure 4 is a right side view showing the forming mechanism 20, Figure 5 is a plan view showing the main part of the molding mechanism 20, Figure 6 is a plan view showing the main part of the molding mechanism 20 from below the fixing member 51, Figure 7 is a bottom view shown from below the mold 40, Figure 8 is an exploded perspective view showing the state of the assembly mold 40, Figure 9 It is a bottom view showing the state after the mold 40 is pulled out from the thermoforming apparatus, Figure 10 is a plan view showing t...

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Abstract

The invention provides a thermoforming apparatus with which a sheet is formed using a die while heating it with a hot plate, and a method of replacing the die of the thermoforming apparatus. In the apparatus and the method, die replacement is easy and the working time necessary for die replacement can be shortened. The thermoforming apparatus has: a sheet conveyance mechanism by which a sheet is conveyed to a given conveyance direction passing through a given molding position; a molding mechanism which has a hot plate disposed so as to be located on one side of the sheet in the molding position and a die disposed in the die-side molding position corresponding to the other side of the sheet located in the molding position and having a molding surface facing the hot plate and in which when the sheet has been conveyed to the molding position, the hot plate and the die are brought near and the sheet is molded so as to conform to the shape of the molding surface while heating the sheet; anda die-drawing mechanism by which the die can be drawn from the die-side molding position to a given drawing direction different from the sheet conveyance direction.

Description

technical field [0001] The invention relates to a thermal forming device which heats a sheet by a hot plate and forms it by a mold. Background technique [0002] In the thermoforming device described in Patent Document 1, when the resin sheet is sent in by the resin sheet feeding mechanism, the heating plate and the mold are separated, and the heating plate and the mold are brought close to the incoming resin sheet to heat the resin sheet. The resin sheet is softened, and the heated and softened resin sheet is deformed according to the shape of the mold surface of the mold to form a molded article. In this device, the mold is fixed relative to the upper table. [0003] Patent Document 1: JP-A-2005-297399 [0004] When the mold is to be replaced in the above-mentioned apparatus, since it is necessary to remove the mold fixed in the apparatus and install another mold in the thermoforming apparatus, this operation is not easy and takes a lot of time. Contents of the inventi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C51/30B29C33/30B29C51/10B29C51/18
CPCB29C51/30B29C51/18B29C51/38B29C51/10
Inventor 高井俊广世古昭久前田龙司阿部正幸
Owner ASANO LABORATORIES CO LTD