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Flexible metal-clad laminate plate

A technology of metal cladding and laminates, applied in the direction of metal layered products, metal material coating processes, coatings, etc., can solve the problems of increased equipment cost and difficulty in making thickness, and achieve improved handling, sagging, and poor suppression. effect that occurs

Active Publication Date: 2008-07-30
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the stretching process has the problems of increased equipment cost and difficulty in making a thick film, and further improvement is required.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0128] (Example 1-3; Synthesis of polyimide film)

[0129] With the inside of the reaction system kept at 5°C, 3,4'-diaminodiphenyl was added at the molar ratio shown in Table 1 to N,N-dimethylformamide (hereinafter also referred to as DMF). Ether (hereinafter also referred to as 3,4'-ODA) and bis{4-(4-aminophenoxy)phenyl}propane (hereinafter also referred to as BAPP) were stirred. After visually confirming the state after dissolution, benzophenone tetracarboxylic dianhydride (hereinafter also referred to as BTDA) was added at the molar ratio shown in Table 1, and stirred for 30 minutes.

[0130] Next, pyromellitic dianhydride (hereinafter also referred to as PMDA) was added at the molar ratio shown in Table 1, and stirred for 30 minutes. Then, p-phenylenediamine (hereinafter also referred to as p-PDA) was added at the molar ratio shown in Table 1, and stirred for 50 minutes. Next, PMDA was added again at the molar ratio shown in Table 1, and stirred for 30 minutes.

[0131...

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PUM

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Abstract

The invention provides a flexible metal-clad laminate plate with good appearance which can be manufactured by a metalizing method such as evaporation coating, sputtering or plating. A flexible metal-clad laminate plate can solve the problem having a polyimide film. The polyamide film is produced by reacting an aromatic diamine with an aromatic acid dianhydride to produce a polyamide acid and then imidizing the polyamide. The polyamide film has (A) an inflexion point of the storage modulus falling within the range from 270 to 340 DEG C, (B) the peak top of tand (which is a value given by dividing the loss modulus by the storage modulus) falling within the range from 320 to 410 DEG C, (C) the storage modulus at 400 DEG C falling within the range from 0.5 to 1.5 GPa, and (D) the storage modulus a1 (GPa) at the inflexion point and the storage modulus a2 (GPa) at 400 DEG C both falling within the range satisfying the following formula (1). Formula (1): 70<=[(a1-a2) / a1<]x100<=85.

Description

technical field [0001] The present invention relates to a flexible metal-clad laminate in which defects in conductor layer formation are suppressed by improving the handling properties of a polyimide film. Background technique [0002] In recent years, with the reduction in weight, miniaturization, and high density of electronic products, the demand for various printed circuit boards has been increasing, and the demand for flexible printed circuit boards (hereinafter also referred to as FPC) has particularly increased. A flexible printed wiring board has a structure in which a circuit made of metal foil is formed on an insulating film. [0003] The flexible metal-clad laminate used as the basis of the above-mentioned flexible wiring board is generally manufactured by the following method: using a flexible insulating film formed of various insulating materials as a substrate, heating a metal foil through various adhesive materials and Pressing to make it adhere to the surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/088B32B15/08C08J5/18H05K1/03C08L79/08
CPCC08G73/1067Y10T428/31681C08L79/08B32B27/34H05K1/0393B32B15/08C23C14/205H05K1/024H05K1/0346H05K2201/0154B32B15/088C08J5/18H05K1/03
Inventor 菊池刚金城永泰藤本省吾
Owner KANEKA CORP