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LED bracket processing method, LED bracket unit and bracket for LED bare core test

A technology of LED bracket and bracket unit, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc. It can solve the problems of not reflecting the real level of LED bare cores, unfavorable LED bare core research, and affecting comprehensive test results, etc.

Active Publication Date: 2012-02-08
JIANGXI LATTICEBRIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a test method after packaging the LED chip cannot reflect the real level of the LED bare core, which is not conducive to the research on the LED bare core
For example, in order to test the fatigue test of LED chip light decay, it is necessary to increase the current of the chip, and the epoxy resin that encapsulates the chip will age rapidly under the heat of the LED chip, thus affecting the comprehensive test results

Method used

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  • LED bracket processing method, LED bracket unit and bracket for LED bare core test
  • LED bracket processing method, LED bracket unit and bracket for LED bare core test
  • LED bracket processing method, LED bracket unit and bracket for LED bare core test

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Embodiment Construction

[0021] The invention provides a LED bracket processing method for LED bare core testing.

[0022] The product embodiment structure that the present invention relates to is as follows, see figure 1 shown. Generally, an LED bracket is provided with 20 bracket units (4 are shown in the figure, and the others are omitted) connected together, and the bracket units are connected together by the upper rib 1 of the bracket and the lower rib 2 of the bracket.

[0023] A single support unit is mainly composed of a bowl cup 3 , a first electrode pin 4 and a second electrode pin 5 for supporting the bowl cup 3 . An LED chip (i.e. bare core) 6 is placed in the bowl cup 3, and the LED chip 6 is sealed in the bowl cup 3 by epoxy resin. The wire 7 connects the second electrode pin 5 and the LED chip 6 . The upper rib 1 of the bracket connects multiple bracket units, and connects the first electrode pin 4 and the second electrode pin 5 .

[0024] A core wire 8 is wound between the first e...

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Abstract

The present invention relates to a LED production and manufacturing process, which discloses an LED bracket processing method for LED bare core testing, an LED bracket unit and a bracket, wherein the solution includes: a step of solid crystal bonding wire; a step of winding and shaping: Wind the core wire between the upper rib of the bracket and the cup, connect the first electrode pin and the second electrode pin of the bracket unit with the core wire, and connect each bracket unit in series, and then mark the core wire Curing glue to make the core wire solidified and shaped; the step of cutting ribs. Compared with the prior art, for testing the parameters of the LED chip, the present invention can carry out the photoelectric test of the LED lamp in the bare core state, so the related parameters of the LED chip obtained are more accurate, which is beneficial to the research of the LED chip.

Description

technical field [0001] The invention relates to a manufacturing process of LEDs, in particular to a packaging and testing method in the manufacturing process of LEDs. Background technique [0002] The prior art such as Chinese Patent No. is 200620018317, the patent titled "the bowl and cup structure of the LED support". The LED bracket described in this technology includes the upper rib of the bracket, the lower rib of the bracket and two electrode pins of the bracket unit. A bowl for placing LED chips is provided on one electrode pin, and the ribs on the support are connected to the two electrode pins. [0003] Similar to the prior art of the above-mentioned LED bracket, the test of the LED lamp is to first encapsulate the bare core of the LED with epoxy resin to form a finished product, and then test the finished product. The test can be carried out as described in Chinese Patent No. 200310115661, entitled "Method and System for Improving Testability of Packaged Integrat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L21/66
Inventor 刘卫华熊细春江余李雄健
Owner JIANGXI LATTICEBRIGHT
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