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Electronic apparatus and semiconductor package

A technology of electronic equipment and semiconductors, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as silicon chip damage

Inactive Publication Date: 2008-08-20
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of large-sized heat-receiving plates is especially likely to cause damage to the above-mentioned silicon chip

Method used

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  • Electronic apparatus and semiconductor package
  • Electronic apparatus and semiconductor package
  • Electronic apparatus and semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Hereinafter, embodiments of the present invention applied to a portable computer will be described with reference to the drawings.

[0030] Figures 1 to 5 show a portable computer 1 of an electronic device according to a first embodiment of the invention. As shown in FIG. 1, the portable computer 1 includes a host 2 and a display unit 3.

[0031] The host 2 includes a box-shaped housing 4. The housing 4 includes an upper wall 4a, a side wall 4b, and a lower wall 4c. The housing 4 is divided into a cover 5 including an upper wall 4a and a bottom 6 including a lower wall 4c. The shell cover 5 is combined with the shell bottom 6 from above, and is removably supported by the shell bottom 6. The upper wall 4a supports the keyboard 7. For example, a plurality of ventilation holes 4d open in the side wall 4b.

[0032] The display unit 3 includes a display housing 9 and a liquid crystal display module 10 therein. The display module 10 includes a display screen 10a. The display scre...

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PUM

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Abstract

According to one embodiment, an electronic apparatus is provided with a semiconductor package, a heat receiving plate, and a gap adjusting member. The semiconductor package includes a substrate and a silicon die mounted on the substrate. The heat receiving plate is opposed to the silicon die and thermally connected to the silicon die. The gap adjusting member is disposed between the heat receiving plate and a region of the substrate apart from the silicon die and serves to reduce a gap which exists between the substrate and the heat receiving plate.

Description

Technical field [0001] One embodiment of the present invention relates to a semiconductor package thermally connected to a heat receiving plate and an electronic device having the semiconductor package. Background technique [0002] For example, electronic devices such as portable computers are equipped with semiconductor packages, including CPUs, graphics chips, and so on. Since these semiconductor packages generate heat during operation, most of them are equipped with heat receiving plates that promote heat radiation. [0003] Japanese Patent Application Publication No. 2002-280499 describes a cooling module in which a heat sink is thermally connected to a heat generating component. The cooling fins of the cooling module can be floatingly arranged in the cooling module housing. The heat sink is pressed toward and against the heat generating component by an elastic member such as a coil spring. Therefore, the heat sink is reliably thermally connecte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/367H01L23/40H05K7/20G06F1/20
CPCH01L2924/0002G06F1/203H01L23/427H01L23/4006H01L2924/00
Inventor 西山茂树
Owner KK TOSHIBA