Portable die cleaning apparatus and method thereof

A cleaning equipment, portable technology, applied in the direction of discharge tube, electrical components, plasma, etc., can solve problems such as hindering the molding process, achieve the effect of clean removal, reduce environmental pollution, and reduce inconvenience

Inactive Publication Date: 2008-09-03
PSM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the resin residue is attached or adhered to the cavity due to repeated molding processes, the resin residue becomes one of the reasons for hindering the molding process

Method used

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  • Portable die cleaning apparatus and method thereof
  • Portable die cleaning apparatus and method thereof
  • Portable die cleaning apparatus and method thereof

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Experimental program
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Embodiment Construction

[0025] Best Mode for Carrying Out the Invention

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0027] figure 1 is an exploded perspective view illustrating a mold cleaning device according to an embodiment of the present invention together with a mold to be cleaned, and figure 2 is a schematic drawing figure 1 A cross-sectional view of the state where the mold cleaning device shown in is fixed to the mold.

[0028] Such as figure 1 and figure 2 As shown in , a mold 2 to be subjected to surface cleaning is a mold for use in molding semiconductor chips (not shown), and has a plurality of cavities 2a formed therein serving as spaces to be filled with resin during molding s surface. Since the resin residue d (see image 3 ) mainly adheres to the inner surface of the cavity 2a of the mold 2, so it is very necessary to clean the mold 2, especially the surface of the cavity 2a of...

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PUM

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Abstract

The present invention relates to a portable die cleaning apparatus and a die cleaning method using the same. It is an object of the present invention to provide a portable die cleaning apparatus capable of performing a plasma cleaning process for a surface of a die, especially surfaces of cavities in the die, by using plasma discharge generated in a reaction chamber that is defined on the die, without separating the die. In order to achieve this object of the present invention, the present invention provides a portable die cleaning apparatus for cleaning a surface of a die using plasma discharge. The portable die cleaning apparatus of the present invention comprises a frame with an open lower face to define a reaction chamber facing the surface of the die between the surface of the die and the frame itself when the frame is seated on the die; and an active electrode that is placed at a position opposite to the die in a state where the die is electrically grounded, and receives electric power from an external power supply to generate plasma in the reaction chamber.

Description

technical field [0001] The present invention relates to a portable mold cleaning device and a mold cleaning method using the portable mold cleaning device, and more specifically, the present invention relates to a portable mold cleaning device and a mold cleaning method using the portable mold cleaning device A mold cleaning method in which a mold for use in molding semiconductors, electronic components, or the like with resin can be cleaned by a plasma cleaning process performed by plasma discharge without separating said mold. Background technique [0002] In the process of manufacturing electronic components (especially semiconductors), resin execution is performed on a substrate (such as a lead frame or a ball grid array (BGA)) on which a semiconductor chip is mounted in a state where the substrate is supported by a mold. molding process. Such a molding process is performed by filling a plurality of cavities formed in the mold with resin. However, since the resin resid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L2924/0002H01J37/32862H05H1/24H01L21/67028H01L21/67017H01J37/32091H01J37/32348H01J37/32825H01L2924/00H01L21/02H01L21/56H01L23/28
Inventor 李海龙李近浩金德宰吴正根金道现
Owner PSM
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