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High density holes thin wall honeycomb ceramic extrusion mold and manufacturing method thereof

A manufacturing method and technology of honeycomb ceramics, applied in ceramic extrusion dies, electrolysis process, electroforming, etc., can solve the problems that the mold has no practical value, the lattice wall cannot be reduced, and the hole density has not increased, and the hardness is large. , Improve the service life and reduce friction

Inactive Publication Date: 2008-09-10
北京创导奥福科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if you want to reduce the diameter of the mud guide hole, you must use a drill bit with a small diameter, and if you want to reduce the width of the cutting groove, you must also use a thinner cutting molybdenum wire. As far as the current domestic drill bit and molybdenum wire market is concerned, there is still There are no products that can meet the requirements, which is also one of the main reasons that limit the increase in the hole density of domestic honeycomb ceramic molds and the inability to reduce the grid wall
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Method used

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  • High density holes thin wall honeycomb ceramic extrusion mold and manufacturing method thereof

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Embodiment 1

[0021] Embodiment 1 Electroless nickel plating alloy, (design is 600 order, grid wall thickness is 0.12mm, and the grid wall thickness of semi-finished product is 0.18mm) the semi-finished product mold that will produce is put into the cleaning liquid that configures containing surfactant in turn Clean the mold thoroughly with ultrasonic vibration and pure water to ensure that no dirt and rust remain on the surface of the mold. Hang the cleaned mold in the circulating chemical plating solution. The temperature of the chemical plating solution should be controlled between 40°C and 100°C. The speed of chemical plating will increase with the increase of temperature. When the surface of the mold is uniform After coating a layer of nickel alloy with a thickness of 30um, the finished mold is taken out of the plating solution, and the residual liquid on the surface is washed away with water, so that a finished mold with a 600-mesh grid and a wall thickness of 0.12mm is completed. .Th...

Embodiment 2

[0022] Example 2 Electroless plating of silicon carbide: the processed 900-purpose semi-finished mold (the diameter of the mud guide hole is 1.0 mm and the width of the cutting groove is 0.15 mm, and the design requirements of the mold are that the diameter of the mud guide hole is 0.93 mm and the width of the cutting groove is 0.08 mm ) is cleaned according to the same cleaning method as in Example 1, and then the mold is put into the plating solution according to the above same method for coating treatment. The plating solution used here is due to the addition of nanometer silicon carbide in the conventional alloy steel plating solution , so that when the surface of the mold is covered with the alloy coating, nanometer silicon carbide particles will be deposited and embedded in the alloy steel coating at the same time. The residual liquid is cleaned up, so that a mold with a 900 mesh grid wall thickness of 0.08mm is produced. In order to increase the strength of the mold, th...

Embodiment 3

[0023] Example 3 Vapor deposition of tungsten carbide: Clean the processed semi-finished mold with 600 mesh and grid wall thickness of 0.15mm according to the same method as in the above example, and then put the semi-finished mold into the airtight equipment for special vapor deposition treatment. On the object table, set the deposition time according to the parameters of the coating thickness of 25um, and then turn on the equipment according to the conventional vapor deposition method. After the equipment stops running, take out the finished mold, and the finished mold becomes a 600-mesh grid with a wall thickness of 0.1mm . The strength of the mold produced by this method is higher than that of the above example, but the mold is prone to deformation.

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Abstract

The invention relates to 'a high hole density thin wall honeycomb ceramic extrusion die and the manufacturing method', which belong to the field of ceramic machining A method for manufacturing high hole density thin wall honeycomb ceramic extrusion die comprises the following steps that: (1) the number of holes and wall thickness to be designed are fixed, (2) a drill with a diameter which is 0.1 mm longer than the designed hole diameter of the front mud guiding hole and a molybdenum wire with a diameter which is 0.1mm larger than the width of the designed rear incising groove are adopted to make half-finished die, (3) at least one layer of coating of hard metallic material or hard ceramic material is plated and attached on the surface of the mud guiding hole and the cutting groove. The coating attached to the surface of the conventional die ensures the die to make honeycomb ceramics with high hole-density and thin case wall. At the same time, the finish degree of the surface is good, the friction between the die and the mud is caused to be reduced due to the high hardness of the coating and better surface finish, thus increasing the whole strength and weary resistance of the die and extending the service life of the die.

Description

technical field [0001] The invention relates to the field of honeycomb ceramic processing, in particular to a high-density thin-walled honeycomb ceramic extrusion die. Background technique [0002] Honeycomb ceramics have been widely used as catalyst carriers in various industries due to their excellent properties such as high specific surface area, high water absorption, high mechanical strength, high thermal stability, and high corrosion resistance. Because the catalyst does not participate in the chemical reaction during the chemical reaction, but it can greatly promote the intensity of the chemical reaction, and if the catalyst wants to promote the chemical reaction, it must be in full contact with the substances participating in the chemical reaction, so the ratio of the catalyst The size of the surface area directly affects the performance of the catalyst. The honeycomb ceramics used as the catalyst carrier must provide a large specific surface area for the catalyst a...

Claims

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Application Information

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IPC IPC(8): B28B3/26
CPCC25D1/08B28B3/269
Inventor 潘吉庆
Owner 北京创导奥福科技发展有限公司
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