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Apparatus and method for mounting silicon ingot to mounter

A technology for fixers and silicon crystals, which is applied in fine working devices, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve problems such as excessive spare space, disadvantages, and extended processing cycles

Inactive Publication Date: 2008-10-01
斯尔瑞恩公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the conventional die-fixing process dries the epoxy adhesive by so-called natural drying, thus unnecessarily prolonging the processing cycle of the entire process for processing wafers and disadvantageously requiring too much spare space for drying

Method used

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  • Apparatus and method for mounting silicon ingot to mounter
  • Apparatus and method for mounting silicon ingot to mounter

Examples

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Embodiment Construction

[0020] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0021] figure 2 is a schematic illustration of a conventional process for securing a silicon ingot to a holder according to a preferred embodiment of the present invention.

[0022] refer to figure 2 , according to an embodiment of the device 100 for fixing a silicon crystal block includes: a frame 10; a fixer 20 arranged on the frame 10; a pressing part 40 movably mounted on a support 12 arranged on the frame 10, The press is used to press the silicon ingot 30 against the holder 20; a heat or light emitting member 50 for emitting heat or light to the bonding member 22 between the silicon ingot 30 and the holder 20; The reflective member 60 near the heat or light emitting member 50 serves to concentrate the heat or light emitted from the heat or light emitting member onto the adhesive member 22 .

[0023] The frame 10 includes: a fl...

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PUM

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Abstract

The present invention relates to apparatus and method for a silicon ingot to a mounter, the apparatus including a frame; a mounter placed on the frame for mounting a silicon ingot; a press member installed movably to the frame for pressing the silicon ingot toward the mounter; and a heat or light emitting member arranged to emit heat or light to an adhesive member interposed between the silicon ingot and the mounter.

Description

technical field [0001] The present invention relates to an apparatus and method for securing a silicon ingot to a holder, and in particular, to an improved apparatus and method for securing a silicon ingot to a holder which is useful when dicing a silicon ingot into wafers Previously, the silicon ingot was attached to the holder with an adhesive, and the adhesive was then dried. Background technique [0002] Generally, in order to process the silicon ingot into individual wafers, the grown silicon ingot is cut into individual wafers by a slicing operation. The slicing process simultaneously slices a silicon ingot into multiple wafers, and performs the process by a method using piano (steel) wire or high-tension steel wire, such as a so-called wire saw (W.S) method. However, in order to cut the silicon ingot, the silicon ingot should be fixed to a special jig, which is referred to as the ingot fixing process. [0003] A conventional die-fixing process is schematically shown...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D7/04B28D5/00B28D1/02
CPCB28D5/0082Y10T156/10H01L21/30H01L21/20H01L21/302
Inventor 赵容浚
Owner 斯尔瑞恩公司