Semiconductor component bearing structure and splicing structure

Abstract

The invention provides semiconductor component loading structures and splicing structure thereof. The semiconductor component loading structures include: a circuit board with at least an opening, a semiconductor component with a plurality of electrode pads and a plurality of conductive projections. A circuit layer is equipped on surface of the circuit board and has a plurality of electric connection pads and conductive structure; the semiconductor component is embedded in the opening, the electrode pads electrically connect the circuit layer by the conductive structure; the conductive projections are equipped on surface of the electric connection pads; each of the semiconductor component loading structures are equipped with soldering balls corresponding to the conductive projections to joint the conductive projections of one circuit board to the soldering balls of another circuit board, thereby forming the splicing structure.

Description

technical field [0001] A semiconductor component bearing structure and its stacking structure, especially a bearing technology integrating the semiconductor component bearing structure and its stacking structure on a circuit board. Background technique [0002] The miniaturization of electronic products is the development trend of the electronic industry today. With the miniaturization of electronic product manufacturing, there is a demand for higher density of semiconductor components with different functions embedded on a circuit board. Therefore, at least two or more semiconductor chips are placed and electrically connected on a single chip carrier, and the chip and the carrier are connected in such a way that the semiconductor chips are stacked upward one by one on the carrier, and then Solder wires for electrical connection. [0003] Please refer to FIG. 1 , which is a schematic cross-sectional view of a multi-chip semiconductor package 1 of US Pat. No. 5,323,060, in w...

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Problems solved by technology

[0005] However, in the above-mentioned manufacturing method, due to the limited electrical function of a single carrier board 20 embedding a single semiconductor component 21, if the electrical function of the carrier board 20 is to be increased, the number of the semiconductor components 21 must be increased. A plurality of openings 200 are provided on the carrier board 20, but the area of ​​the carrier board 20 is limited and cannot be expanded, thus limiting the expansion and development of the electrical functions of the carrier board 20

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