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Cooling structure of electric device

A technology for electrical devices and cooling structures, which is applied in the direction of electrical components, electrical solid devices, electrical equipment structural parts, etc., can solve the problem of increasing the size of cooling structures, and achieve the effect of reducing size and suppressing changes

Inactive Publication Date: 2010-05-19
TOYOTA JIDOSHA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this difference can be suppressed by increasing the distance between the inlet and the location of multiple cooling medium channel branches, the size of the cooling structure will increase

Method used

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  • Cooling structure of electric device
  • Cooling structure of electric device
  • Cooling structure of electric device

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Experimental program
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Embodiment Construction

[0021] Embodiments of the cooling structure for electric devices according to the present invention will be described below. The same or corresponding elements have the same reference numerals, and description thereof will not be repeated.

[0022] figure 1 An example of the configuration of a drive unit including a cooling structure for an electric device according to an embodiment of the present invention is schematically shown. exist figure 1 In the illustrated embodiment, the drive unit 1 is included in a hybrid vehicle. The motor generator 100, the housing 200, the reduction gear mechanism 300, the differential mechanism 400, the drive shaft support 500, and the terminal base 600 constitute a drive unit.

[0023] Motor generator 100 is a rotating electric machine functioning as a motor or a generator, and includes a rotating shaft 110 rotatably connected to housing 200 via a bearing 120 , a rotor 130 connected to rotating shaft 110 , and a stator 140 .

[0024] The ro...

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Abstract

A cooling structure of an electric device is provided with a plurality of cooling medium paths (724) wherein a cooling medium for an inverter flows; an inlet section (722) into which the cooling medium to be supplied to the cooling medium paths (724) flows; and a wall (726) arranged between the inlet section (722) and the cooling medium paths (724) for promoting dispersion of the cooling medium into each of the cooling medium paths (724).

Description

technical field [0001] The present invention relates to a cooling structure for an electrical device, in particular, to a cooling structure for an electrical device including a plurality of cooling medium passages. Background technique [0002] Japanese Patent Laid-Open No. 11-340393 discloses a cooling structure for an inverter as an electrical device. In this structure, the fins are formed on the surface of the heat receiving member opposite to the surface on which the semiconductor element is mounted. By fitting the cover over the ribs, channels are formed through which liquid flows from an external source. [0003] In the cooling structure disclosed in the above-mentioned publication of Japanese Patent Laid-Open No. 11-340393, the fins define a plurality of cooling medium passages. The flow rate of the cooling medium from one inlet to the plurality of cooling medium channels may differ from one cooling medium channel to another. Although this difference can be suppres...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H02M1/00H01L23/473
CPCH01L23/473H05K7/20927H01L2924/0002H01L2924/00
Inventor 朝仓健
Owner TOYOTA JIDOSHA KK