Modularization equipment and method for connecting principal and subordinate module thereof

A modular, module interface technology, applied in digital transmission systems, electrical components, transmission systems, etc., can solve the problems of high-level compatibility and limited portability of master-slave modules, shorten product development cycle, improve Portability, the effect of saving development costs

Active Publication Date: 2008-11-05
BEIJING XINWANG RUIJIE NETWORK TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to propose a modularized device and its master-slave module connection

Method used

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  • Modularization equipment and method for connecting principal and subordinate module thereof
  • Modularization equipment and method for connecting principal and subordinate module thereof
  • Modularization equipment and method for connecting principal and subordinate module thereof

Examples

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Example Embodiment

[0022] image 3 It is a schematic structural diagram of an embodiment of a modular device of the present invention. The modular device includes a master module 31 and a slave module 32. The address lines of the slave module interface of the master module 31 that require low-level signals are grounded through a resistor. Take the slave module interface 25 in the master module 31 as an example. Since its address is 25, which is "11001", its address line A1 and address line A2 require low-level signals. Therefore, both address line A1 and address line A2 are It is connected to the low level GND through the resistor R1; all address lines of the slave module interface of the slave module 32 are connected to the high level Vcc through the resistor R2. The resistance value of the grounding resistance, that is, the resistance R2 may be 10Ω˜500Ω. In this embodiment, the resistance value of the resistance R1 is 100Ω, and the signals in the address line A1 and the address line A2 are strong...

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Abstract

The invention relates to modularization equipment and a method for connecting principal and subordinate module thereof. The equipment includes a principal module and a subordinate module, wherein address wires requiring low level signals of the subordinate module interface of the principal module are earthed through address wires; all address wires of the subordinate module interface of the subordinate module are connected with high-level through resistors. The method only pulls-down the addresses required to set low level in the principal module, but pulls-up all addresses in the subordinate module, so that the high-level of subordinate module interface is not limited by the principal module, subordinate modules set with different high-levels are connected to the principal module and can normally work, thereby resolving the problem that the address interface high-level of the subordinate module is not matched with the principal module; meanwhile, the principal module using different platforms can adopt a same subordinate module, and the module portability and compatibility between modules are improved, thereby greatly shortening product developing cycle and saving product development cost.

Description

technical field [0001] The invention relates to modular equipment, in particular to a modular equipment capable of improving module compatibility and portability and a master-slave module connection method thereof. Background technique [0002] Modules are differentiated according to performance, function or use, and their interfaces and sizes are standardized. Modularization is the mainstream of product design at present, and equipment composed of multiple modules is called modular equipment. For enterprises, modular equipment can improve product scalability and enrich product forms. Moreover, the modules can be reused on different platforms, which improves the product reuse rate and greatly reduces the cost of the enterprise. [0003] In modular equipment, modules are divided into master modules and slave modules according to their functions and uses. Among them, the main module is used to control the operation of the slave module and the whole product, and there is usu...

Claims

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Application Information

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IPC IPC(8): H04L12/56H04L25/02
Inventor 林荣丰
Owner BEIJING XINWANG RUIJIE NETWORK TECH CO LTD
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