Photocuring resin composition, dry film, and print circuit board

A technology of photocurable resin and composition, applied in secondary processing of printed circuits, optics, optomechanical equipment, etc., can solve problems such as defects, and achieve the effects of reduced halogen gas generation, excellent concealment, and low halogen content
CN101303528AActive Publication Date: 2008-11-12TAIYO INK MFG +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TAIYO INK MFG
Publication Date
2008-11-12

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Abstract

The invention provides a coloring photo-curing resin composition and condensate thereof, dry film and printing circuit board, which can form a solder resist layer with excellent concealment of color change caused by oxidation of copper circuit. The photo-curing resin composition can develop through alkali water solution and contains carboxylic acid resin (A), photopolymerization initiator (B), compound (C) with more than two olefinic unsaturated radicals and red colorant (D).
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Description

technical field

[0001] The present invention relates to a colored photocurable resin composition not containing halogen-containing phthalocyanine green. More specifically, the present invention relates to a colored photocurable resin composition that does not contain halogen-containing phthalocyanine green and can provide a solder resist layer excellent in concealment of discoloration due to oxidation of copper circuits. Background technique

[0002] Typically, solder resist is formed to protect copper circuits. This is useful in that discoloration due to heat and moisture in the copper circuit, electrical discoloration, flaws and contamination on the copper circuit cannot be seen.

[0003] The solder resist is applied to the glass epoxy base material on which the copper circuit is formed, an image is formed by exposure, and the film pattern is formed by developing and thermosetting. Since a copper circuit is formed on the base material, when applying a solder resist or la...

Claims

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