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Heat radiation fan fixing structure

A heat dissipation fan and fixed structure technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of inconvenience, unfavorable assembly and maintenance efficiency, etc., and achieve the effect of increasing convenience

Inactive Publication Date: 2008-11-26
MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to reduce the noise generated by the computer device during operation, the manufacturer or user may use a cooling fan with a larger size than the original cooling fan in order to have better cooling effect and lower noise, so the screw 101 will be blocked by the heat dissipation fan, so it is necessary to pass a screwdriver through the heat dissipation fan 104 and apply force to the screw 101. Since the heat dissipation fan 104 has blades, the operator needs to carefully avoid the blades of the heat dissipation fan 104. Therefore seems very inconvenient, is not conducive to improving the efficiency of assembly and maintenance

Method used

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Embodiment Construction

[0015] In order to have a further understanding of the purpose of the present invention, structural features and functions thereof, hereby cooperate with the drawings to describe in detail as follows:

[0016] Please refer to shown in Fig. 2, it is the three-dimensional assembly drawing of the radiator that implements the fixed structure of cooling fan of the present invention, and this radiator 2 is set on the mainboard (not shown) of electronic device, in order to heat generation on the mainboard. Devices (such as a central processing unit, etc.) cooperate to take away the heat generated by the heating device while maintaining the temperature of the heating device within the normal operating temperature range. The radiator 2 usually includes a Surface-attached heat dissipation fin module 23, the heat dissipation fin module 23 is provided with a number of superimposed heat dissipation fins 230 to increase the area in contact with the air, thereby accelerating heat dissipation,...

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Abstract

The present invention relates to a fixing structure of a radiator fan. The fixing structure is applied to a radiator of an electronic device. The radiator is assembled at a mainboard by retaining screws at four corners and comprises a radiating fin module, one surface of which is jointed with the surface of a heating apparatus of the electronic device. Two opposite sides of radiating fins are provided with retaining screws which is used for fixing the radiator. The other surface of the radiating fin module is sheathed with a fixed frame, one side of which is provided with a an elastic buckle, and the opposite surface between the radiator fan and the radiating fin module is assembled with a fitting fix, and one side of which is provided with a buckle part which is corresponding to an elastic buckle of the fixing frame. that is, the radiator fan can be assembled at the radiating fin module by buckling the elastic buckle and the buckle part, in a similar way, the radiator fan can be removed by unbuckling the elastic buckle and the buckle part, and a screwdriver is used for fixing the retaining screws at the mainboard, so as to increase the convenience for assembling and demounting.

Description

technical field [0001] The present invention relates to a heat sink of an electronic device, in particular to the fixing structure of the heat dissipation fan of the heat sink. Using the fixing structure of the heat dissipation fan, the heat dissipation fan can be detachably fixed to other components of the heat sink on, so as to facilitate the assembly and disassembly of the radiator. Background technique [0002] In recent years, with the rapid development of computer technology, the operating speed of the computer has been continuously improved, and the heating power of the electronic devices inside the computer mainframe has also been continuously increased. In order to prevent the electronic devices inside the computer mainframe from overheating, resulting in temporary or permanent failure of the electronic devices, it is very important to provide sufficient cooling performance to the electronic devices inside the computer. Take the central processing unit (CPU) as an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor 张志源吴敏瑞
Owner MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY