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Heat radiating module and electronic combination applying the same

A heat dissipation module and electronic technology, applied in the direction of circuit layout, electrical components, printed circuits, etc. on the support structure, can solve the problems of cost increase, circuit board 50 damage, etc., and achieve the effect of improving reliability and not easy to fall off

Inactive Publication Date: 2010-06-02
COMPAL ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the use of these E-rings 140 can prevent these fixing elements 120 from breaking out of these through holes 112, when these E-rings 140 get loose and fall on the circuit board 50, it may cause the circuit board 50 to be damaged due to a short circuit, so it must be pointed out that A fixation method that can replace the existing known heat dissipation module to improve this problem
In addition, the conventionally known fixing elements 120 must form annular grooves 120a to engage the E-rings 140 respectively, so these fixing elements 120 must be specially made, thus increasing the cost

Method used

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  • Heat radiating module and electronic combination applying the same
  • Heat radiating module and electronic combination applying the same
  • Heat radiating module and electronic combination applying the same

Examples

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no. 1 example

[0050] image 3 is a top view of the heat dissipation module according to the first embodiment of the present invention, Figure 4 along image 3 Sectional view of line B-B in middle. see image 3 and Figure 4 , the heat dissipation module 200 has a heat sink 210 , a plurality of fixing elements 220 , a plurality of elastic elements 230 and a plurality of fixing structures 240 . The heat sink 210 has a plurality of through holes 212 . Each through hole 212 has a first end 212a, a second end 212b and a shoulder 212c, wherein the shoulder 212c is located between the first end 212a and the second end 212b.

[0051] The fixing element 220 has a head 222 and a shaft 224 connected to the head 222, wherein the head 222 is located in the through hole 212, and is located between the first end 212a and the second end 212b, and the shaft 224 is also located in the through hole 212. In hole 212. The elastic element 230 is located in the through hole 212 and surrounds the fixing el...

no. 2 example

[0059] Figure 6 is a top view of the electronic combination of the second embodiment of the present invention, Figure 7 for along Figure 6 Sectional view of line C-C. see Figure 6 and Figure 7 , the electronic assembly 400 includes a circuit board 300 and a heat dissipation module 200 . The heat dissipation module 200 has been disclosed in detail in the first embodiment, so it will not be repeated here. The circuit board 300 has a heating element 310 , and the heat sink 210 contacts the heating element 310 to remove heat generated by the heating element 310 . The shaft portion 224 of the fixing element 220 is assembled to the circuit board 300 .

[0060] In this embodiment, the circuit board 300 further has a stud 320 . The stud 320 has an inner thread, and the shaft portion 224 of the fixing element 220 has an outer thread matching the inner thread of the stud 320, so that the fixing element 220 can be locked to the stud 320, so that the cooling module 200 fixed ...

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Abstract

The invention relates to a heat dissipating module group, comprising a heat radiator, a fixer, an elastic element and a fixing structure, wherein the heat radiator is provided with a through hole witha first end and a second end, the through hole is provided with a shoulder between the first and second ends, the fixer is provided with a head and an axle connected with the head, the heat is in thethrough hole and between the first end and the shoulder, the axle is in the through hole, the elastic element is in the through hole around the fixer, the fixing structure is arranged on the heat radiator and extended into the through hole for limiting the head of the fixer in the through hole. The invention can improve the reliability of an electric assembly adopting the heat dissipating modulegroup and can reduce cost.

Description

technical field [0001] The invention relates to a heat dissipation module and an electronic combination using the same, in particular to a heat dissipation module with high reliability and an electronic combination using the same. Background technique [0002] In recent years, portable electronic devices have been developing towards small and multi-functional devices. The more powerful portable electronic devices must have higher-speed chips, but the higher-speed chips will generate more heat. In addition, The miniaturization of portable electronic devices makes the cooling module an indispensable component of the portable electronic devices. [0003] figure 1 It is a top view of an existing conventional heat dissipation module assembled to a circuit board with heating elements, figure 2 along figure 1 Sectional view of line A-A in middle. see figure 1 and figure 2 , the circuit board 50 has a heating element 52 , and the cooling module 100 is assembled on the circui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K1/00H05K7/02
Inventor 许毅峰张倢玮
Owner COMPAL ELECTRONICS INC