Processing apparatus
A technology of processing equipment and processing heads, used in metal processing equipment, welding equipment, metal processing, etc.
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[0028] figure 1 A processing apparatus, ie a solder bonding apparatus, according to an embodiment of the present invention is schematically illustrated. The solder bonding apparatus 11 includes a processing head unit, that is, a heating head unit 12 . The heater head unit 12 is fixed to the back plate 13 . The back plate 13 is supported on the guide rails 14 . The guide rails 14 extend in the vertical direction. The back plate 13 is designed to move in the vertical direction along the guide rails 14 .
[0029] A power source, the actuator 15 , is connected to the back plate 13 . The actuator 15 applies a driving force to the back plate 13 . The driving force from the actuator 15 allows the back plate 13 to move up and down in the vertical direction.
[0030] The heater head unit 12 includes a heater tip 16 . The heater tip 16 is supported on the support member 17 . The support member 17 is fixed to the back plate 13 . The heater tip 16 serves as a processing head or h...
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