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Anti-leakage type photoresist bottle

A photoresist bottle and anti-drip technology, applied in optics, optomechanical equipment, instruments, etc., can solve the problems of work environment damage, cleaning troubles, photoresist corrosion, etc., and achieve the effect of ensuring the working environment

Inactive Publication Date: 2008-12-03
HEJIAN TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the traditional photoresist bottle is replaced or replenished, the residual photoresist in the liquid outlet pipe will drop to the raised floor under the action of gravity, causing damage to the working environment
And the photoresist is corrosive, once the working environment is polluted, subsequent cleaning will be very troublesome

Method used

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  • Anti-leakage type photoresist bottle
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  • Anti-leakage type photoresist bottle

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Embodiment Construction

[0017] The technical solutions of the present invention will be described more fully below with reference to the accompanying drawings. Typical embodiments of the invention are shown therein, but the invention can be practiced in various ways and is not limited to only the embodiments set forth herein. On the contrary, providing these embodiments can make the disclosure of the technical solution of the present invention more thorough and comprehensive, and will fully convey the protection scope of the present invention to those skilled in the art.

[0018] Such as figure 1 and figure 2 Shown is a schematic structural view and a schematic top view of the anti-drip photoresist bottle of the present invention. The anti-drip type photoresist bottle includes a bottle body 1, a bottle cap 2, an air inlet pipe 21, a liquid outlet pipe 22, a liquid suction pipe 23 and a threaded hose 24, and the air inlet pipe 21 passes through the inlet pipe 2 on the bottle cap 2. The pressure ho...

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PUM

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Abstract

The invention relates to a dripproof photoresistive bottle used for providing a flow-controllable corrosive photoresist for an etching process in the IC (integrated circuit) manufacturing process. The structure of the photoresistive bottle comprises a bottle body, a bottle cover, an intake pipe and an outlet pipe, and the bottle body is connected with the bottle cover through threads, and the intake pipe and outlet pipe are communicated with the internal part of the bottle body through the bottle cover. The photoresistive bottle is characterized in that a retractable tube is arranged between the bottle cover and the bottle body, and simultaneously, the outlet pipe is divided into a liquid-absorbing section and a liquid-draining section which are respectively connected with an upper end and a lower end of the retractable tube, and after connection the internal parts of the three parts are mutually communicated to form a half-way sealed liquid absorbing-draining path. The photoresistive bottle of the invention can effectively prevent the photoresist from leaking to the outside of the bottle in an operation process so as to solve the problem that the work environment is often contaminated and the contaminated environment is difficult to be cleaned.

Description

technical field [0001] The invention relates to a liquid agent container, in particular to a photoresist bottle for controlling the flow rate of the liquid agent in the bottle through external pressure. Background technique [0002] With the rapid progress of integrated circuit technology, the degree of integration is constantly increasing, and the chip area is constantly shrinking, which also puts forward higher requirements for the manufacturing process of integrated circuits. After decades of repeated research, practice, improvement, and practice, today's IC process technology has reached a relatively mature level. "Etching", as an important part of the current IC manufacturing process, is playing an increasingly important role in improving the integration of integrated circuits. In this process, photoresist is an indispensable preparation material for this process. The etching is completed by covering, exposing, developing and removing the photoresist to provide the pos...

Claims

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Application Information

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IPC IPC(8): G03F7/00H01L21/027
Inventor 薛伟
Owner HEJIAN TECH SUZHOU
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