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Vacuum treatment device, vacuum treatment method and storage medium

A vacuum processing device and vacuum processing technology, applied in the direction of flow control of electric devices, gaseous chemical plating, coating, etc., can solve problems such as no discovery, and achieve the effects of component cost suppression, resolution improvement, and good processing

Active Publication Date: 2009-01-07
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the present inventors conducted a survey of prior art documents regarding the structure in which APC valves and semi-fixed valves are provided on a plurality of exhaust passages connected to the vacuum chamber, but found no prior art documents that should be described.

Method used

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  • Vacuum treatment device, vacuum treatment method and storage medium
  • Vacuum treatment device, vacuum treatment method and storage medium
  • Vacuum treatment device, vacuum treatment method and storage medium

Examples

Experimental program
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Embodiment 1

[0084] Pressure control valves are provided on two of the above-mentioned exhaust passages 51, and gate valves GV are provided on the other four exhaust passages 51. The processing container 20 is exhausted, and the relationship between the pressure in the processing container 20 and the opening degree of the pressure control valve AV at that time is obtained. exist Figure 8 The result is indicated by the data of ▲. In the figure, the horizontal axis represents the opening degree of the pressure control valve AV, and the vertical axis represents the pressure of the processing container. At this time, the opening degrees of the two pressure control valves AV are the same.

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Abstract

The invention provides a vacuum processing device for regulating pressure in a high precision, and vacuum processing method and storage medium. A processing container (20)in which a vacuum processing for something to be processed is performed is communicated with eight exhaust pipes (51), vacuum exhaust unit (52) is communicated with another end of the eight exhaust pipes(51), the processing container is configured for matching with four exhaust pipes (51)of the eight; based on pressure detection value and pressure set value, pressure control valve AV for controlling opening of the automatic control exhaust pipe (51) is matching with exhaust pipes (51) other than exhaust pipes (51) providing with the pressure control valve AV, gate valve GV is set to selected opening of exhaust pipes (51).

Description

technical field [0001] The present invention relates to a technique for controlling the pressure in the processing container when a predetermined vacuum process is performed on an object to be processed such as an FPD (Flat Panel Display) substrate or the like in the processing container. Background technique [0002] In the manufacturing process of an FPD substrate such as an LCD (liquid crystal display) substrate, there is a step of subjecting an object to be processed to a predetermined vacuum treatment such as etching treatment and film formation treatment under a reduced-pressure atmosphere. Regarding an example of a vacuum processing apparatus for performing these steps, taking the apparatus for performing the above-mentioned etching treatment as an example, based on Figure 9 For brief description, 1 in the figure is a vacuum chamber, and a mounting table 11 for mounting an object to be processed, such as an FPD substrate S, is provided inside the vacuum chamber 1, and...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/3065C23C16/455G05D7/06
CPCG02F1/1303H01L21/67161H01L21/67253
Inventor 早川升出口新悟
Owner TOKYO ELECTRON LTD
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