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Stacking slice type piezoresistor and manufacturing method thereof
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A technology of varistors and varistors, applied in varistor cores, resistor manufacturing, varistors, etc., can solve problems such as high production costs, long production cycles, and low product qualification rates, and achieve shortened Production cycle, the effect of saving manufacturing cost
Active Publication Date: 2011-02-02
SHENZHEN ZHENHUA FU ELECTRONICS
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Problems solved by technology
Wet production has strict requirements on casting slurry, and its production cycle is longer and the production cost is higher
Moreover, the erosion of the material by the electroplating bath and the diffusion of the electroplating will cause changes in the properties of the material, and it is not easy to electroplate nickel and tin, and the product qualification rate is low
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Embodiment 1
[0079] The manufacturing method of the piezoresistor provided by the embodiment of the present invention comprises the following steps:
[0080] (1) Powder preparation:
[0081] The varistor film material was ground and mixed uniformly for 20 hours until the particle size was 1.0 μm, dried at 150°C, and sieved with 80 mesh. The material components and their weight percentages were:
[0082] Zinc Oxide ZnO 85%
[0083] Bismuth oxide Bi 2 o 3 3.5%
[0084] Antimony oxide Sb 2 o 3 5%
[0085] Cobalt oxide Co 3 o 4 2%
[0086] Manganese Carbonate MnCO 3 0.5%
[0087] Chromium oxide Cr 2 o 3 1%
[0088] Nickel oxide Ni 2 o 3 1%
[0089] Aluminum nitrate Al(NO 3 ) 3 9H 2 O 0.01%
[0090] Silver nitrate AgNO 3 0.02%
[0091] boric acid H 2 BO 3 1%
[0092] Barium titanate BaTiO 3 0.97%.
[0093] Grind and uniforml...
Embodiment 2
[0115] (1) Powder preparation:
[0116] The varistor film material was ground and mixed uniformly for 20 hours until the particle size was 1.0 μm, dried at 150°C, and sieved with 80 mesh. The material components and their weight percentages were:
[0117] Grind and uniformly mix the ceramic protective layer material for 20 hours until the particle size is 1.0 μm, dry at 150°C, and sieve through 80 mesh. The material components and their weight percentages are:
[0118] Zinc Oxide ZnO 3%
[0119] Silicon oxide SiO 2 50%
[0120] Bismuth oxide Bi 2 o 3 8%
[0121] Boron oxide B 2 o 3 12%
[0122] Alumina Al 2 o 3 15%
[0123] Calcium oxide CaO 6.5%
[0124] Magnesium Oxide MgO 2.5%
[0125] Manganese Carbonate MnCO 3 3%.
[0126] (2) configure the slurry: configure the slurry with the above-mentioned powder ratio, and the method is the same as in Example 3.
[0127] (3) Tape making...
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Abstract
The invention is suitable for various electrical apparatus fields, and provides a multi-layer chip voltage-dependent and process for preparation, wherein the voltage-dependent comprises an upper cover, a lower cover, a voltage dependent resistor unit and a terminal electrode, the upper cover and the lower cover are made from voltage dependent resistor materials, and the voltage dependent resistorunit is arranged between the upper cover and the lower cover and is equipped with two inner electrodes. The multi-layer chip voltage-dependent and process for preparation are characterized in that the two inner electrodes are separately printed, a binding film is printed on one inner electrode, a voltage dependent resistor membrane band is printed on the binding film, and the other inner electrode is printed on the voltage dependent resistor membrane band. The process for preparation comprises the processes which are proportioning, pulping, preparing band, printing, hot water voltage sharing,cutting, dumping, sintering, sealing end and electroplating and the like. The multi-layer chip voltage-dependent is prepared through the process of the invention, the production cycle of products is greatly reduced, and the making cost of the products is saved.
Description
technical field [0001] The invention relates to a multilayer chip piezoresistor and a manufacturing method thereof. Background technique [0002] In the existing technology, the chip varistor is a new type of high-tech chip manufactured by using slurry film formation, lamination, pressure equalization, cutting, sintering, sealing, firing, electroplating and other chip processes. Type components are widely used in various mobile communication equipment, household appliances, medical equipment, automobiles and other fields. At present, most manufacturers at home and abroad adopt the "wet production process" of wet casting and lamination molding. Due to the strict requirements on casting slurry, wet production has a long production cycle and high production cost. Moreover, the erosion of the material by the electroplating bath and the diffusion of the electroplating will cause changes in the properties of the material, and it is not easy to perform electroplating nickel and t...
Claims
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Application Information
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