Method for processing step ladder PCB plate

Abstract

The invention relates to a method for processing a ladder PCB plate, which includes the following steps: an inner layer core plate is provided; prepregs are provided; a ladder groove is arranged at the prepregs correspondingly with the inner layer core plate and the two prepregs are attached to the two sides of the inner layer core plate; corresponding silicon rubber slices are placed in the ladder groove of the prepregs; steel sheets are positioned at the external sides of the two prepregs and are pressed by a pressing machine which carries out the gummosis and molding to the prepregs; the silicon rubber slices are taken out of the ladder groove. The method for processing the ladder PCB plate fills the silicon rubber slices in the ladder groove of the prepregs to barrier the gummosis and ensures that the gummosis amount is stable, controllable and meets the design requirement of customers; in addition, the silicon rubber slices can be easily taken out without sticking to the bottom of the groove, are simple and effective and are convenient and suitable for processing the ladder PCB plate.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture, in particular to a method for processing a stepped PCB board. Background technique [0002] During the production process of stepped PCB boards, the adhesive flow in the stepped slots is unstable and uneven, which does not meet the design requirements of end customers and affects the placement of components. [0003] In order to solve the above technical problems, the existing technology adopts auxiliary materials to stop, but there is a problem that the flow glue flows to the bottom of the tank through the gap and the blocking auxiliary materials cannot be taken out. Contents of the invention [0004] The purpose of the present invention is to provide a method for processing a stepped PCB board, which uses silica gel sheets to fill the stepped grooves to block the flow of glue, so as to ensure a stable and controllable flow of glue, and at the same time, it can be easily taken ...

AI Technical Summary

Problems solved by technology

[0002] During the production process of stepped PCB boards, the adhesive flow in the stepped slots is unstable and uneven, which does not meet the design requirements of end customers and affects the placement of components

[0003] In order to solve the above technical problems, the existing technology uses auxiliary materials to block, but there is a problem that the flow glue flows to the bottom of the tank through the gap and the blocking auxiliary materials cannot be taken out.

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