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Capacitor microphone

A technology of condenser microphones and conductive characteristics, which is applied in the direction of electrostatic transducer microphones, sensors, semiconductor electrostatic transducers, etc., and can solve the problems of reduced maximum sound pressure rating, diaphragm sticking, and fixing to the substrate, etc.

Inactive Publication Date: 2009-02-11
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the diaphragm may accidentally stick or be fixed to the substrate; therefore, the conventional known condenser microphone has a reduced maximum sound pressure rating and is weak against impact

Method used

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Examples

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Embodiment Construction

[0056] The present invention is described in further detail by way of examples with reference to the accompanying drawings.

[0057] 1. Structure

[0058] figure 1 is a plan view showing a MEMS structure of a condenser microphone according to a preferred embodiment of the present invention. Figure 2A is along the figure 1 A cross-sectional view taken along the line 2A-2A in; Figure 2B is along figure 1 A cross-sectional view taken along the line 2B-2B.

[0059] The condenser microphone of the present invention comprises a diaphragm 10 and a plate 20 (which form a parallel plate capacitor), a substrate 30, a plurality of first supports 50 (for supporting the diaphragm 10 above the substrate 30), and a plurality of second supports 54 (for supporting the plate 20 above the base plate 30).

[0060] For example, the substrate 30 is a single crystal silicon substrate having a thickness ranging from 500 μm to 600 μm. A through hole 30 a forming a side wall of the rear cavity 32...

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PUM

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Abstract

A condenser microphone includes a substrate having an opening in a back cavity, a diaphragm including a center portion and a plurality of arms extended in the radial direction from the center portion, a plate positioned opposite the diaphragm, and a support structure for supporting the periphery of the diaphragm and the periphery of the plate above the substrate while insulating the diaphragm and the plate both having conductive properties from each other. The support structure forms gaps between the substrate, the diaphragm, and the plate. Projections having insulating properties are formed in the center portion and the arms of the diaphragm so as to project towards the substrate and are separated from each other in the circumferential direction of the diaphragm. This prevents the diaphragm from being unexpectedly adhered and fixed to the substrate, thus improving the sensitivity of the condenser microphone.

Description

technical field [0001] The present invention relates to condenser microphones used as micro-electro-mechanical-system (MEMS) microphones. [0002] This application claims priority from Japanese Patent Application No. 2007-206462, the contents of which are incorporated herein by reference. Background technique [0003] Generally, various kinds of small silicon condenser microphones are manufactured through semiconductor device manufacturing processes. They are disclosed in various documents such as Patent Document 1, Patent Document 2, Patent Document 3, and Non-Patent Document 1. [0004] Patent Document 1: Japanese Patent Application Publication No. H09-508777 [0005] Patent Document 2: Japanese Patent Application Publication No. 2004-506394 [0006] Patent Document 3: US Patent No. 4,776,019 [0007] Non-Patent Document 1: MSS-01-34 published by Japanese Institute of Electrical Engineers [0008] The aforementioned condenser microphones are known as MEMS microphones,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/005H04R31/00H04R7/06H04R19/04H04R31/006
Inventor 平出诚治铃木民人大村昌良蛯原雄作
Owner YAMAHA CORP
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